Our vision is to transform how the world uses information to enrich life for
all.
Micron Technology is a world leader in innovating memory and storage solutions
that accelerate the transformation of information into intelligence, inspiring
the world to learn, communicate and advance faster than ever.
In the TD Advanced Modeling Group in Hyderabad, you will work in a
multi-functional team of engineers highly skilled in the modeling of process,
equipment, structures, and materials. This team’s primary responsibility is to
support TDAM team in Boise, ID, US to enable solutions for Micron’s most
significant challenges in Memory development and manufacturing.
Your role will be to work on a project that directly supports our Structure and
Stress modeling program. This program involves stress-strain analysis based on
structural mechanics applied to semiconductor products. You are expected to work
in a dynamic and quick-paced team environment developing and deploying models,
communicating results to the team members, and collaborating with them on next
steps.
This position seeks individuals that can deploy and utilize stress
models, proficient in AI / Gen AI tools.
Job Description
Qualifications:
* Independence – be comfortable executing on projects and maintaining
documentation
* Outstanding teamwork
* Experience with numerical methods and scientific computing
* Strong background in constitutive modeling in solid mechanics
* Familiarity with machine learning and deep learning concepts and
applications
* Familiarity with thermo-mechanical modeling
* Advanced skills in level set method (LSM) for CAD, meshing, DOE, analysis,
rendering
* Experience with FEA tools
* Experience with Abaqus, ANSYS
* Strong debug and problem-solving skills
* Experience in writing reports and conference papers
* Excellent written and verbal communication
* Ability to work in a team environment and experience with remote
collaboration tools