HCP Technologies is a Bengaluru-based provider of advanced capital equipment for the Semiconductor, PCB/SMT, Electronics, 3 D Printing, EV Battery, and Automotive industries — serving research and manufacturing clients across India.
We're looking for a hands-on Field Services Engineer to install, commission, and maintain equipment at customer sites, including IC decapsulation systems, wire bonders, die bonders, LPCVD furnaces, deposition systems etc.,
You'll be responsible for:
On-site installation, commissioning & calibration Troubleshooting,
repairs & technical support Preventive maintenance & service scheduling Customer training & relationship management Service documentation & escalation coordination
What we're looking for:
Diploma/B. E./B. Tech in Electronics, Electrical, Mechanical, Mechatronics, or related field Hands-on experience with semiconductor, electronics, or industrial capital equipment (highly preferred) Solid troubleshooting skills — able to read schematics, use diagnostic tools & interpret manuals Willing to travel across India; comfortable in cleanroom/lab environments Clear communication in English (local language knowledge a plus)