Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata
Group with expertise in manufacturing precision components.
Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building
India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility
will produce chips for applications such as power management IC, display
drivers, microcontrollers (MCU) and high-performance computing logic, addressing
the growing demand in markets such as automotive, computing and data storage,
wireless communications and artificial intelligence.
Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in
more than 100 countries across six continents, with the mission 'To improve the
quality of life of the communities we serve globally, through long term
stakeholder value creation based on leadership with Trust.’
Purpose of the Job:
* This role is responsible for developing cutting-edge, cost-effective
packaging solutions for integrated circuits, ensuring optimal performance,
reliability,
and manufacturability.
* Fully accountable for new product development – design > material selection >
qualification > LVM > Offload and process engineer providing end to end
technology & process development, covering conventional & advanced packages.
* Able to lead technically the team of experts, to achieve all the
deliverables, through flawless execution on the NTI / NPI programs and
service the customer timely.
Key Responsibilities:
* Able to be hands-on, in designing DOE, Process characterization &
optimization, develop manufacturable recipe meeting all the CTQ matrices &
yield.
* Solid understanding of semiconductor packaging materials, processes, and
failure mechanisms.
* Must be very familiar and hands-on experience on the TD / NPI methodology,
covering all the process involved
* Provide direction, technical leadership and hands-on experience to ensure all
different functional dept work in sync to ach