The Engineer – SMT
Machine (X-ray Programming) is responsible for programming, operating, and
optimizing X-ray inspection systems used in SMT (Surface Mount Technology)
manufacturing. The role ensures high-quality solder joint inspection, defect
detection, and continuous process improvement in PCB assembly.
Key
Responsibilities:
Develop
and optimize X-ray inspection programs for SMT assemblies (BGA, QFN, CSP,
etc.)
Operate
and maintain X-ray inspection machines (AXI/Manual X-ray systems)
Analyze
X-ray images to detect defects such as voids, shorts, misalignment, and
insufficient solder
Work
closely with production and quality teams to resolve soldering and
assembly issues
Perform
root cause analysis using X-ray data and implement corrective actions
Validate
recent product introduction (NPI) by creating inspection programs and
standards
Ensure
compliance with IPC standards (e.g., IPC-A-610)
Maintain
documentation for inspection programs, reports, and process changes
Train
operators and technicians on X-ray inspection procedures
Support
continuous improvement initiatives (yield improvement, defect reduction)
Coordinate
with SMT machine engineers for process optimization
Required
Skills & Qualifications:
Bachelor’s
degree in Electronics, Electrical Engineering, or related field
2–5 years
of experience in SMT manufacturing or PCB assembly
Hands-on
experience with X-ray inspection systems
Solid
understanding of SMT processes and soldering defects
Knowledge
of BGA void analysis and IPC standards
Ability
to interpret X-ray images and technical drawings
Familiarity
with AOI/AXI programming is an advantage
Valuable
problem-solving and analytical skills
Preferably
Nordson Matrix Axi- programming is helpful