The Manager II – PCB Simulation role is a hands‑on technical leadership position within the Digital Data & Networks (DDN) business unit at TE Connectivity . This role leads a team of engineers focused on high‑speed Signal Integrity (SI) simulation and supporting domains including Power Integrity (PI), EMC/RFI, and thermal analysis.

The primary objective of this role is to ensure PCB designs meet performance, reliability, and manufacturability requirements through accurate simulation, early risk identification, and close collaboration with design and cross‑functional engineering teams—prior to prototyping and mass production.

Key Responsibilities

Team Leadership & Execution

- Lead, mentor, and develop a team of PCB simulation engineers with a strong focus on Signal Integrity (SI) for high‑speed interfaces.
- Manage workload distribution, project prioritization, and technical quality of deliverables.
- Support capability development, onboarding, and continuous technical upskilling within the team.

Simulation Technical Ownership

- Drive hands‑on SI simulation for high‑speed interfaces such as DDR, PCIe, Ethernet, and high‑speed serial links .
- Support simulations related to PI, EMC/RFI, and thermal behavior as part of holistic PCB validation.
- Interpret simulation results and provide clear, actionable recommendations to PCB design teams.

Design Review & Validation

- Conduct PCB design and simulation reviews to identify risks and performance gaps early.
- Ensure simulation correlation with lab / experimental results.
- Drive design optimizations to enable first‑time‑right manufacturability for prototypes and volume production.

Cross‑Functional Collaboration

- Work closely with global hardware design, mechanical, and manufacturing teams to align simulations with product requirements.
- Communicate simulation outcomes, design risks, and improvement recommendations to stakeholders,



customers, and suppliers when needed.

Process & Quality Improvement

- Improve simulation methodologies, workflows, and accuracy standards.
- Stay current with emerging technologies, high‑speed design standards (IPC, JEDEC, PCIe, USB, Ethernet), and simulation tools.
- Contribute to QCD (Quality, Cost, Delivery) objectives through efficient execution.

Project Management

- Independently manage multiple PCB simulation projects, ensuring schedule adherence and technical quality.
- Support estimation, execution tracking, and issue escalation.

Candidate Desired Profile

Education

- Full‑time Bachelor’s degree in Electrical or Electronics Engineering
- Master’s degree preferred
- (ITI / Diploma + BTech / MTech combinations not acceptable)

Experience

- ~ 15 years of hands‑on experience in high‑speed PCB Signal Integrity simulation
- 5–7 years of people‑management or technical leadership experience
- Strong experience delivering complex, high‑speed hardware projects within tight schedules

Technical Skills (Mandatory Focus on SI)

- Strong expertise in Signal Integrity (SI) simulation for high‑speed digital designs
- Working knowledge of PI, EMC/RFI, and thermal analysis
- Experience with tools such as:
- Ansys SIwave / HFSS
- Cadence Sigrity
- Keysight PathWave ADS / SIPro
- Siemens HyperLynx
- CST Studio, ICEPAK, FLOTHERM, CELSIUS
- Foundational understanding of PCB layout, routing, stack‑ups, libraries, and manufacturability
- Knowledge of DFM, IPC, JEDEC, PCIe, USB, Ethernet standards

Soft Skills

- Robust technical leadership and execution capability
- Excellent problem‑solving and analytical skills
- Good documentation, reporting, and presentation skills
- Clear verbal and written communication with technical and non‑technical stakeholders
- Ability to collaborate effectively across global teams and time zones
- Proficiency in MS Office tools (Word, Excel, PowerPoint, Outlook, Teams)

📌 MGR II R&D/PRODUCT DVL ENGINEERING - SI SIMULATION (Bangalore Metropolitan Area)
🏢 TE Connectivity
📍 Bangalore Metropolitan Area