Wirebond Process Engineering Lead (Mayang)

Wirebond Process Engineering Lead (Mayang)

15 Aug
|
Tata Electronics
|
Mayang

15 Aug

Tata Electronics

Mayang

Process Engineering head will provide technical and organizational leadership for end-to-end IC packaging process development, high volume manufacturing readiness, and continuous improvement across wirebond and flip chip technologies. The role is accountable for process yield, reliability, cost, scalability and technology roadmap execution, while building robust cross functional alignment with NPI & TD, equipment, quality and customer teams.

Key Responsibilities
- Technology & Process Leadership.

Key Deliverables & KPI
Essential Attributes
- Own end-to-end process integration for
- Wafer /Die Preparation (Wafer thinning, Dicing (Laser, Mechanical), 2nd optical Inspection)
- Die attach (Direct, Flipchip, Thin die, Epoxy, Film, Sintering)
- Wire bond (Au, CuPd, Al, Ball Bond, Wedge Bond)
- Underfill, Plasma clean
- Taping & 3rd Optical
- Encapsulation (Transfer Mold, Compression Mold and Lid attach)
- Plating & Marking
- Solder ball attach, Reflow and Flux cleaning
- Package Separation (Cutting, Forming, Singulation) & FV Inspection.
- Define and maintain process windows,



control plans and CTQ across all package families.
- Lead technology qualification, scaling from development to high volume manufacturing.
- Drive technology/process roadmaps aligned to customer, market and package needs.
- NPI & Manufacturing Readiness.
- Lead EVT/ DVT / PVT readiness from a process perspective.
- Partner with NPI, Product Engineering, and TD to ensure DFM and DFR.
- Ensure smooth technology transfer from development to production.
- Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.
- Yield, Reliability & Quality Excellence.
- Accountable for first pass yield, final yield and field reliability.
- Lead root cause analysis for yield excursions using SPC, FMEA, DOE and failure analysis.
- Own JEDEC reliability qualification of the packages/devices.
- Partner with Quality team to address customer returns, audits and escalations.
- Equipment Supplier Management
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📌 Wirebond Process Engineering Lead (Mayang)
🏢 Tata Electronics
📍 Mayang

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