Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In the TD Advanced Modeling Group in Hyderabad, you will work in a multi-functional team of engineers highly skilled in the modeling of process, equipment, structures, and materials. This team’s primary responsibility is to support TDAM team in Boise, ID, US to enable solutions for Micron’s most significant challenges in Memory development and manufacturing.
Your role will be to work on a project that directly supports our Structure and Stress modeling program. This program involves stress-strain analysis based on structural mechanics applied to semiconductor products. You are expected to work in a agile and quick-paced team workplace developing and deploying models, communicating results to the team members, and collaborating with them on next steps.
This position seeks individuals that can deploy and utilize stress models, proficient in AI / Gen AI tools.
Job Description
Qualifications:
Independence – be comfortable executing on projects and maintaining documentation
Outstanding teamwork
Experience with numerical methods and scientific computing
Strong background in constitutive modeling in solid mechanics
Familiarity with machine learning and deep learning concepts and applications
Familiarity with thermo-mechanical modeling
Advanced skills in level set method (LSM) for CAD, meshing, DOE, analysis, rendering
Experience with FEA tools
Experience with Abaqus, ANSYS
Strong debug and problem-solving skills
Experience in writing reports and conference papers
Excellent written and verbal communication
Ability to work in a team environment and experience with remote collaboration tools
Background in semiconductor industry is desirable
Fam