Senior Ic Substrate Package Layout Designer Bengaluru

Senior Ic Substrate Package Layout Designer Bengaluru

14 Aug
|
MaxLinear
|
Bengaluru

14 Aug

MaxLinear

Bengaluru

We are looking for an experienced Senior IC Substrate Package Layout Designer to lead advanced semiconductor package development from die netlist analysis, bump feasibility and package planning through substrate layout, SI/PI optimization, and manufacturing release. The role requires close collaboration with Backend/Physical Design, SI/PI, Assembly, Reliability, and Manufacturing teams to deliver high-performance package solutions for complex SoCs and multi-die products. You will focus on:
Own complete package design activities including die bump planning, pin assignment, floorplanning, package routing, stackup definition, and package signoff
Perform bump feasibility studies and optimize package architecture for routability, SI/PI performance, manufacturability, reliability, and cost
Design and implement substrates for FCCSP, HFCBGA/FCBGA, Leadframe, Multi-Chip Modules (MCM), SiP, Interposer, Chiplet-based and advanced 2.5D/3D packages
Collaborate closely with Backend, SI/PI, Thermal, Assembly, OSAT, and substrate vendors to resolve design and manufacturing challenges




Support package verification, design reviews, and tape-out activities while ensuring compliance with technology and assembly requirements

Qualifications
Bachelors or Masters degree in Electrical/Electronics Engineering or related field
4+ years of experience in IC package/substrate layout design
Expert-level proficiency in Cadence Allegro Package Designer (APD/APD XL), SiP Layout, and Constraint Manager
Robust understanding of substrate stackups, material selection, HDI technologies, via structures, package assembly processes, and reliability considerations
Working knowledge of Signal Integrity, Power Integrity, impedance control, differential routing, PDN design, return path optimization, and crosstalk management
Hands-on experience with high-speed interfaces including SerDes, PAM4, PCIe, DDR/LPDDR, HBM, Ethernet, CXL, USB, UCIe, and other multi-gigabit interfaces

Preferred Qua

📌 Senior Ic Substrate Package Layout Designer Bengaluru
🏢 MaxLinear
📍 Bengaluru

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