JOB DETAILS:

JOB DESCRIPTION:

Altera is seeking a highly skilled and motivated Design Thermal Engineer to
contribute to the thermal design, analysis, and optimization of our cutting-edge
semiconductor products. This role involves ensuring robust thermal performance
and reliability across various product lines.

As a key member of Full Chip Global Power Intent Thermal Team, you will be
responsible for all aspects of FPGA Power Intent and Thermals. Responsibilities
include Thermal verification of die, package, software and board. Valuable cross
functional collaboration needed to verify, debug, and signoff system level
Thermal closure. In addition to thermal closure, you will get experience working
on power intent verification using UPF, power electrical rule checking, power
rollup at die and package level, and system EM and IR closure, die package bump
and ball planning.

QUALIFICATIONS:

The successful candidate's minimum qualifications will include the following:
BS/MS in Mechanical Engineering
Industry experience for minimum of 4 years




Familiar with thermal tools
Experience with UPF, Verdi, Redhawk, power IR/EM, physical design, and power
on sequence is a plus
Comfortable with PERL/Python, TCL, Linux Shells
Excellent execution and solid drive to close complex design issues
Valuable communication and presentation skills to enable cross functional
interaction

JOB TYPE:

Regular

SHIFT:

Shift 1 (India)

PRIMARY LOCATION:

Bengaluru, Karnataka, India

ADDITIONAL LOCATIONS:

POSTING STATEMENT:

All qualified applicants will receive consideration for employment without
regard to race, color, religion, religious creed, sex, national origin,
ancestry, age, physical or mental disability, medical condition, genetic
information, military and veteran status, marital status, pregnancy, gender,
gender expression, gender identity, sexual orientation, or any other
characteristic protected by local law, regulation, or ordinance.

📌 Design Thermal Engineer Bengaluru
🏢 Altera
📍 Bengaluru