We are seeking an experienced Senior RF IC Test Development Engineer to lead Automated Test Equipment (ATE) hardware and software development for complex RF integrated circuits on the Teradyne UltraFLEX platform. The successful candidate will collaborate with cross-functional teams to develop robust test solutions, optimize test coverage and cost, drive characterization activities, and enhance manufacturing test efficiency and yield.
Your role
Key responsibilities in your new role
Lead ATE hardware and software development for complex RF IC products using the Teradyne UltraFLEX platform.
Collaborate with design, product, validation, and manufacturing teams to develop comprehensive test plans that maximize test coverage while minimizing test cost.
Lead RF IC characterization activities on ATE and analyze test results to ensure product quality and performance.
Work closely with development teams to define Design-for-Test (DFT) requirements and implement effective test strategies.
Develop innovative test methodologies and debug silicon-related issues during product development and production.
Drive continuous improvements in test time reduction, multisite optimization, throughput enhancement, and yield improvement.
Provide regular project updates and technical status reports to core team members and stakeholders.
Support recent product introduction (NPI) activities and production test readiness.
Your profile
Qualifications and skills to help you succeed
Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Semiconductor Engineering, or a related field.
5+ years of experience in semiconductor test development with a proven track record in RF IC test solutions.
Strong expertise in Automated Test Equipment (ATE) development, including both hardware and software.
Hands-on experience with the Teradyne UltraFLEX platform.
Deep understanding of DFT methodologies, including MBIST, JTAG, SCAN, and IDDQ.
Experience in silicon debug, failure analysis,