Job Description:
Design Package layouts for multiple applications.
Able to handle constraints-driven IC Package layout methodology.
Having basic understanding on Signal integrity and power integrity concepts.
Conduct layout reviews with internal layout and design teams.
Release IC Package layout drawings to the various design teams and coordinates their layout activities by ensuring compliance with the Design rules.
Design Rules Check (DRC): Perform design rule checks to ensure that the layout meets the specific manufacturing and design guidelines.
Perform quality assurance by using CAM350 Gerber validation toolsDeliver Accurate layout designs by having basic Knowledge on Design for Manufacturing (DFM): Consider manufacturability and DFA : Craft for Assembly and DFT: Design for Testing.
Proven oral and written communication skills to connect with Customers and Multi-functional teams.
Experience (years) : 8+ years
Education Qualification:
BTECH/MTECH in Electrical/Electronics/Computer Science Engineering or Equivalent
📌 Ic Package Engineer Bengaluru (India)
🏢 Mirafra Software Technologies
📍 India
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