Role ResponsibilitiesSoldering, Rework and SMT Support

- Perform hand soldering and rework on through-hole and surface-mount assemblies, including fine-pitch ICs, QFN and BGA-adjacent components, connectors, and RF shields, to IPC-A-610 Class 2 or Class 3 acceptance criteria.
- Carry out board-level rework, including component replacement, pad and track repair, jumper wiring, and modification implementation against approved ECN and deviation notes.
- Operate and maintain soldering stations, hot-air rework stations, preheaters, and desoldering equipment.
- Control tip temperature, thermal profiles, and dwell time to protect boards and components.
- Enforce ESD-safe working practices at every workstation, including wrist straps, mats, ionisers, and periodic verification logs.
- Support SMT line output where required, including solder paste inspection, reflow profile verification, first-article review, and post-reflow defect assessment.

Firmware Flashing, Provisioning and Traceability
- Execute production firmware flashing across the build using JTAG, SWD, UART, USB, or OTA methods, as applicable to the product.
- Operate and maintain programming jigs, bed-of-nails fixtures, pogo-pin adapters, and gang programmers.
- Diagnose and resolve flashing failures at the fixture, cable, and target level.
- Control firmware version integrity by ensuring the correct approved build is loaded against each work order.
- Maintain firmware version traceability per serial number and prevent mixed-firmware batches from reaching dispatch.
- Perform device provisioning activities, including serial number and MAC assignment, IMEI mapping, SIM configuration, calibration constant loading, security key or certificate injection, and server or APN configuration.
- Coordinate with the firmware and embedded team on release handover, production build validation, and field-issue root cause analysis.
- Provide structured failure feedback from the line back to engineering.

GPS/GNSS and Cellular Testing
- Execute GPS/GNSS functional testing on every unit, including cold start, warm start, and hot start Time-To-First-Fix (TTFF) verification against defined acceptance limits.
- Measure and record C/No carrier-to-noise levels, satellites acquired, satellites tracked, fix type, and position accuracy.




- Reject units falling outside specification.
- Diagnose GPS failures to root cause, including antenna solder or seating defects, RF path discontinuity, LNA failure, ground plane issues, EMI from adjacent circuits, incorrect firmware configuration, or almanac and ephemeris handling.
- Where the product includes cellular connectivity, validate GSM/LTE registration, network attach, signal strength, and end-to-end server communication alongside the GNSS test.

Assembly, Integration and Dispatch Readiness
- Carry out PCBA integration into enclosure, wiring harness routing and dressing, connector mating, fastener torque control, gasket and seal placement, potting or encapsulation, and label application.
- Verify mechanical fit and finish, ingress protection integrity including IP rating, and cosmetic acceptance criteria on every unit.
- Manage build documentation, including assembly work instructions, torque and adhesive specifications, cable schedules, and pictorial aids at each station.
- Drive line balancing, workstation layout, jig and fixture design, and cycle-time reduction across box-build cells.
- Ensure serialisation, barcode labelling, packing configuration, and accessory kitting match customer specifications before dispatch.

Testing, Validation and Fixture Maintenance
- Execute in-circuit, functional, and end-of-line test sequences against approved test plans.
- Operate and support ICT, FCT, and burn-in stations.
- Run environmental and stress screening where specified, including thermal cycling, humidity exposure, vibration, and drop testing.
- Interpret environmental and stress screening data.
- Validate sensor and peripheral function, including accelerometer, gyroscope, temperature, digital and analogue I/O, relay outputs, and CAN or RS-232/RS-485 interfaces, as applicable.
- Maintain, calibrate, and improve test fixtures, harnesses, and automated test scripts.




- Reduce test cycle time without compromising coverage.
- Capture and analyse test data, including first-pass yield, defect Pareto, repeat-failure tracking, and station-level performance.

Quality, Documentation and Continuous Improvement
- Drive first-pass yield improvement and defect reduction using structured problem solving, including 8D, 5-Why, Fishbone, and Pareto analysis.
- Author and maintain SOPs, work instructions, test procedures, ECN implementation records, and control plans for every station.
- Conduct root-cause analysis on line rejections, in-house failures, and field returns.
- Own and close corrective and preventive actions.
- Support NPI and NPD activities, including pilot builds, DFM and DFT feedback to design, fixture readiness, and process validation ahead of mass production.
- Maintain traceability records to lot, date-code, and serial-number level for audit and recall readiness.
- Support internal, customer, and statutory audits.
- Ensure ISO 9001 conformance and, where applicable, IATF 16949, ISO 13485, and AIS-140 requirements.
- Train and certify operators on soldering, flashing, testing, and assembly standards.
- Maintain skill matrices and requalification records.
- Drive 5S, Kaizen, and lean practices on the shop floor.

Required Qualifications
- Diploma or B.E. / B.Tech in EEE or ECE.
- 2–5 years of experience in the EMS / ESDM industry.
- Ability to work full-time from Bytebeam's Bangalore office.

Certifications and Preferred ExposureIPC certification is a solid plus. Any of the following will be viewed favourably, and the company will sponsor certification for the right candidate who does not yet hold one:
- IPC-A-610 — Acceptability of Electronic Assemblies, CIS or CIT.
- IPC J-STD-001 — Requirements for Soldered Electrical and Electronic Assemblies, CIS or CIT.
- IPC-7711/7721 — Rework, Modification and Repair of Electronic Assemblies.
- IPC-A-600 — Acceptability of Printed Boards.
- IPC/WHMA-A-620 — Requirements and Acceptance for Cable and Wire Harness Assemblies.

Other preferred exposure includes:
- J-STD-033 moisture-sensitive device handling.
- ESD control per IEC 61340-5-1 / ANSI-ESD S20.20.
- Six Sigma Green Belt.
- AIS-140 or E-Mark compliance for telematics products.

📌 Production Engineer (Bengaluru)
🏢 Bytebeam
📍 Bengaluru