21 Aug
|
Mulya Technologies
|
Bangalore Metropolitan Area
21 Aug
Mulya Technologies
Bangalore Metropolitan Area
Senior Engineer, Package Design – Bengaluru, KA- India
Top 100 Global Semiconductor MNC in the world
Bangalore
Description
We are a innovative enterprise that designs, develops, and delivers System-on-Chip products to customers worldwide. The company is focused on AR/VR, imaging, networking, storage, and other energetic technologies that drive today’s leading-edge applications. We combine world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, We are headquartered in Japan, and have offices in Japan, Asia, United States and Europe to lead its product development and sales activities.
Senior Engineer, Package Design – Bengaluru, KA- India
Responsibilities:
The Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA)
and working very closely with Package design team in our parent company’s headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during the pre/post sales process.
This position requires a broad knowledge of package technology and design. Successful candidates will have a deep understanding and experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge and experience in extracting/simulating package designs for Signal and Power integrities using tools such as HFSS, and/or ADS tools.
Education:
- Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline
- MS is preferred
Required Experience and Skills:
- 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations
- Record of success in cross-functional team environment
- Good experience with Signal and power integrity tools for package level modeling/extraction/simulation
- Ability to work with Package Layou
📌 Senior Package Design Engineer (Bangalore Metropolitan Area)
🏢 Mulya Technologies
📍 Bangalore Metropolitan Area