Job Description

Responsibilities
Lead block-level and full-chip STA signoff for HBM products across all PVT corners.
Own development and validation of SDC constraints, including clocks, generated clocks, false paths, multicycle paths, case analysis, and async constraints.
Drive timing closure by analyzing and resolving setup/hold, recovery/removal, slew, fanout, and clock-related violations.
Implement clocking solutions for complex HBM designs, including generated clocks, pulse clocks, and zero-cycle, single-cycle, and multi-cycle timing paths.
Correlate STA results with simulation to improve signoff accuracy.
Drive automation and productivity improvements using Tcl/Python for timing analysis, reporting, constraint generation, and debug workflows.
Collaborate closely with Design, Verification, Layout teams to achieve successful tapeout and product qualification.
Mentor engineers and provide technical leadership in STA methodology, timing closure, and signoff best practices.




Capable of Characterizing Basic Standard Cells
Lead technical reviews, risk assessments, and signoff readiness discussions for next-generation HBM products.
Solid experience in STA signoff using PrimeTime or equivalent tools.
Deep understanding of HBM/DRAM architectures and memory timing concepts.
Expertise in SDC development, clock modeling, OCV/AOCV/POCV, and timing closure.
Robust Tcl/Python scripting and automation skills.
Experience with full-chip timing signoff for complex SoC or memory products.
Proven record of technical leadership, innovation, and mentoring.
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Required Qualifications
Education Qualification : BE or MTECH with 5+ Years of experience
Minimum 6+ yrs of hands-on experience in STA signoff.
solid communication skills
Cross site & cross geo interaction

📌 Sta Signoff Hyderabad
🏢 HighPoints Technologies India Private
📍 Hyderabad