22 Aug
|
Infineon Technologies
|
Bengaluru East
22 Aug
Infineon Technologies
Bengaluru East
Our Automotive Microcontroller R&D; team is looking for an experienced SoC HW Systems Engineer to join the Chip-Level Architecture team and own the package, ballout, and IO interface strategy for our next-generation automotive microcontroller platform.
Your role
Key responsibilities in your recent role
- Own the package selection strategy, ballout architecture, and IO ring planning for our next-generation uC platform.
- Analyze and consolidate customer PCB design constraints and system-level integration requirements to drive chip-level packaging decisions.
- Review and maintain the platform ballout map, providing technical feedback across stakeholder teams including implementation, PHY vendors, and customers.
- Drive the datasheet content for IO electrical parameters and system-level interface specifications in collaboration with IP teams and customers.
- Verify PHY and PMIC compatibility with the platform through model-based simulation and parasitic analysis.
- Assess package performance vs.
cost tradeoffs and maintain the holistic picture of package constraints versus customer system needs across the full product family.
- Maintain technical documentation in compliance with ISO 26262 requirements.
Your profile
Qualifications And Skills To Help You Succeed
- Bachelor's or Master's degree in Electrical Engineering or related field.
- At least 7 years of industry experience in semiconductor product development with a background in analog design, package engineering, or SoC system-level design.
- Good knowledge of package types (LFBGA, TFBGA, QFP) and package parasitic modeling.
- Experience with PCB system-level design constraints and customer board integration requirements.
- Understanding of IO ring architecture — pad types, ESD protection strategies, IO power domains.
- Familiarity with ballout planning, signal grouping principles, and PCB routing constraints for automotive microcontrollers.
- Familiarity with ISO 26262 documentation standards.
- Pro-active collab
📌 SoC HW Systems Engineer — Packaging (Bengaluru East)
🏢 Infineon Technologies
📍 Bengaluru East