- Derive sensor-based system level specifications and the circuit architecture
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- ASIC design and tapeout
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- Coordinate with the fab (interact with chip Manufacturing lab team on the PDK (process design kit), ESD (for I/O's) and other technological aspects.
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- Mentor embedded system designer for the ASIC test board design, integration with the ASIC/sensor, circuit testing, set up the prototype characterization work bench
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- Field visit along with the engineers for the field testing, interact with the customers on the sensor-system requirements
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- Preparation of technical reports (design, testing & validation, field experiments), experimental datasets, mentor engineers for project documentation
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- Conduct prior-art and patent search, identify novelty for advancing sensor design, contribute to publications and technology-transfer activities
/n /n /n Minimum Qualifications and Experience: /n /n
- Ph.D. in Electrical Engineering or Electronics Engineering, with a thesis related to Integrated Circuit Design, preferably in Analog/Mixed-Signal IC Design.
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- Prior experience in IC design and tape-out in an academic or industrial setting.
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- Strong publication record or demonstrated experience in IC design and chip testing, particularly in analog/mixed-signal circuits, is preferred.
/n /n /n Required Skills: /n /n
- Ability to interpret domain-specific sensing requirements and translate them into circuit specifications.
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- Strong knowledge of low-power and low-noise circuit design techniques.
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- Experience in sensor signal-conditioning IC design, calibration, and characterization.
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- Full ASIC design flow: System level design → Circuit level design → simulation → layout → pre-manufacturing and sign off → tapeout coordination with the fab (Analog & mixed-signal IC design), ASIC testing and running the experiments
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- Hands-on experience with IC design flows using Cadence, Synopsys, or Siemens EDA toolsets