Bachelor''s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master''s degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
As semiconductor packaging technologies become increasingly complex such as 2.5D and 3DIC, the demand to quickly isolate sources of failure whether from individual chips or chiplets, interconnects, or weaknesses in the manufacturing/assembly processes becomes an even more critical element in delivering cost-effective solutions. We are seeking a highly skilled and innovative engineer to lead the development of recent diagnostics analytical methodologies to isolate sources of semiconductor package failures.
This role goes beyond traditional failure analysis strategiesrequiring creativity, cross-disciplinary thinking, and the development of novel package design features, test algorithms, and software diagnostic technologies that do not yet exist. The ideal candidate will be a creative problem-solver with a strong background in semiconductor packaging, data analytics, and cross-functional collaboration.
Key Responsibilities:
Develop advanced diagnostic methodologies to identify root causes of package failures using electrical test results, software simulation and/or fault models.
Develop advanced analytics machine learning systems which integrates product characteristics, electrical test responses, and packaging manufacturing data to quickly identify sources of failure in advanced conventional semiconductor chip packages
Develop data and analytical systems for assembly and substrate manufacturing processes, including defining data requirements and tra