About Texas Instruments

Texas Instruments (TI) is a global semiconductor company designing, manufacturing, and selling analog and embedded processing chips — powering everything from industrial automation to automotive safety systems worldwide.

About the Team — High Speed Data Interface Product Group

The

High Speed Data Interface product group

focuses on the development of differentiated high-speed

SerDes SoCs

targeted for

automotive and industrial markets . There are two primary focus areas —

Ethernet PHY

and

FPD-Link .

Ethernet PHY Group:

A large number of applications — like in-vehicle driver alertness monitors, steering, or accelerator control in automotive and robotic applications — require an Ethernet interface. The ubiquity of Ethernet-enabled devices allows customers to simplify connecting large numbers of devices in automotive and robotic environments. Customers expect

robust performance

in the presence of interference and ESD events, along with processing offload capabilities. The low-cost migration from CAN to Ethernet presents unique challenges requiring interdisciplinary skills with aggressive cost and power targets.

FPD-Link Group:

The proprietary

FPD-Link interface

addresses

multi-gigabit (up to 20 Gbps)

automotive and industrial sensor and display markets. Constant increase in density of electronic sensing and display content is pushing data rate (>20 Gbps) and BER performance requirements higher. Automotive functional safety requirements demand robust performance at these high data rates under challenging environments while maintaining low power consumption.

The Broader Mission:

As part of this product group, you will be engaged in designing solutions spanning

Analog, Digital, and Signal Processing domains

to mitigate impairments such as high channel loss, ESD strikes, and narrowband interference. The team implements high-performance equalization circuits (CTLE, FFE, DFE), high-speed converters (DAC, ADC), high-speed digital front-ends, signal processing algorithms, embedded microcontrollers, and high-speed interfaces for camera and display systems. The team has successfully achieved several

differentiated innovations

through collaborative cross-domain optimization.

The

entire product lifecycle

— from product specification to customer and application support — is owned by the product group in

Bangalore ,



giving each team member tremendous learning opportunity and enhanced scope to

influence the global success of the product . We are looking for

passionate, creative, and self-driven engineers

who challenge traditional techniques and come up with creative solutions to make a difference.

Role Overview

As an

RFIC Design Engineer , you will bring specialized RF and microwave circuit expertise to one of the most demanding application spaces in semiconductors — high-speed automotive SerDes SoCs. At data rates exceeding 20 Gbps, RF design principles dominate every aspect of the silicon — from transistor-level matching networks to on-chip transmission lines and impedance-controlled interconnects. You will design RF-grade circuits and front-ends that ensure robust, low-noise, low-jitter performance in the electromagnetically hostile automotive environment.

Key Responsibilities

Design

RF and high-frequency analog circuits

for high-speed SerDes PHY SoCs — including LNAs, mixers, VCOs, PLL building blocks, and high-speed I/O drivers operating at multi-GHz frequenciesDevelop

impedance-matched RF front-ends

for high-speed SerDes transmitters and receivers, minimizing signal reflections, return loss, and insertion loss across the target frequency rangeDesign

on-chip passive structures

— transmission lines, baluns, transformers, and inductors — using electromagnetic (EM) simulation to meet RF performance targetsAddress

RF signal integrity challenges

— crosstalk, substrate coupling, ground bounce, and power supply noise — in complex mixed-signal SoC environmentsDevelop

EMI-resilient circuit topologies

for automotive Ethernet PHY front-ends that maintain performance under conducted and radiated EMI per automotive standards (CISPR 25, ISO 11452)Perform

EM/RF simulation

using tools such as Cadence EMX, Keysight ADS, ANSYS HFSS, or Momentum for passive structure characterization and signal integrity analysisCollaborate with analog and digital teams for

RF-aware SoC integration





— managing RF-to-digital isolation, substrate noise coupling, and mixed-signal co-existenceConduct

RF characterization and measurement

on silicon — S-parameter measurements, noise figure, phase noise, and spurious emission characterization in lab environmentsContribute to

IP generation, patent filings , and competitive RF innovations for next-generation SerDes products

✅ Required Qualifications

Education:

B.Tech / M.Tech / Ph.D. in RF Engineering / Microwave Engineering / Electronics / Electrical EngineeringExperience:

3–10 years of RFIC or high-frequency analog IC design experienceStrong expertise in

RF circuit design

— LNAs, VCOs, PLLs, mixers, power amplifiers, or high-speed I/O drivers at GHz frequenciesProficiency in

RF/EM simulation tools

— Cadence Spectre RF, Keysight ADS, ANSYS HFSS, Cadence EMX, or equivalentDeep understanding of

impedance matching, S-parameters, noise figure , and RF performance metricsExperience designing

on-chip passive components

— inductors, transformers, transmission lines — in standard CMOS processesKnowledge of

substrate coupling, crosstalk, and EMI mitigation

in mixed-signal SoC environments

Preferred / Good-to-Have Skills

Experience designing RF circuits for

high-speed SerDes PHY

or wireline applications (>10 GHz)Background in

automotive EMC/EMI standards

— CISPR 25, ISO 11452, IBIS-AMI modelingFamiliarity with

mm-wave circuit design

(28 GHz, 60 GHz, 77 GHz) for automotive radar adjacencyExperience with

RF wafer probing and on-silicon characterization

(S-parameter, noise figure, phase noise)Knowledge of

process design kits (PDK)

for RF-optimized CMOS/SiGe technologiesBackground in

ESD-hardened RF front-end design

for automotive environments

What Makes This Role Unique

RF at the Speed Frontier

Design RF circuits for >20 Gbps SerDes — where every GHz mattersAutomotive RF Challenge

Build EMI-hardened RF front-ends for the world's harshest environmentsFull Lifecycle Ownership

Circuit design → Silicon characterization → Customer deploymentCross-Domain Integration

Unique intersection of RF, analog, digital & signal processingGlobal Automotive Impact

RF innovations deployed in automotive safety systems worldwideCareer Differentiation

Rare RF expertise applied to cutting-edge automotive semiconductor products

📌 RFIC Design Engineer — High-Speed Automotive SerDes SoCs (3–10 Yrs) (Mumbai)
🏢 Texas Instruments
📍 Mumbai