Role & responsibilities

- Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting defined thickness, TTV, bow, warp, and surface quality specifications.
- Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
- Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
- Investigate and troubleshoot process abnormalities including wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
- Collaborate with Production, Quality, Maintenance, and R&D; teams to resolve process challenges and implement new technologies or process upgrades.
- Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.
- Conduct Root Cause Analysis (RCA) and implement Corrective and Preventive Actions (CAPA) for process deviations and quality issues.
- Develop, update, and maintain process documentation including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.
- Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.
- Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.
- Monitor and improve process capability (Cp/Cpk) through Statistical Process Control (SPC) and data-driven process management.
- Ensure compliance with safety,



environmental, quality, and operational standards across all slicing activities.
- Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.
- Support operator training and skill development by providing technical guidance and process-related coaching.
- Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.

Preferred candidate profile

- B.E./B.Tech in Mechanical Engineering.
- 2-7 years of relevant experience in industrial process engineering/manufacturing.
- Robust experience in designing, implementing, and optimizing industrial processes in a manufacturing setup.
- Candidates with experience in Diamond Wire Saw / Diamond Wire Slicing processes will be preferred.
- Good understanding of materials such as diamond wire and diamond tools, along with mechanics such as fluid movement and automation involved in silicon wafer manufacturing.
- Experience in Silicon Wafer manufacturing for semiconductor or solar applications will be preferred.
- Candidates from Solar, Semiconductor, Automobile Parts Machining, or other high-tech manufacturing industries will be preferred.
- Strong analytical and problem-solving skills with experience in engineering statistical methods and data analysis.
- Working knowledge of Microsoft Office and Minitab.
- Knowledge of ISO 9001, ISO 14001, ISO 45001, and ISO 50001.
- Knowledge of Six Sigma, QC Tools, Kaizen, Statistical Process Control (SPC), and TQM will be an added advantage.
- Excellent communication and interpersonal skills.

📌 Slicing Process Engineering - Wafer (Jamnagar)
🏢 SKILLVENTORY
📍 Jamnagar