Responsible for operating and monitoring SMT screen printing, Solder Paste Inspection (SPI), and reflow oven processes to ensure high-quality PCB assembly as per production and quality requirements.
Key Responsibilities
Screen Printer Operation
- Operate and monitor SMT solder paste screen/stencil printing machines.
- Load PCBs and stencils correctly as per the production program.
- Check solder paste condition, quantity, and application.
- Perform stencil cleaning and ensure proper alignment.
- Monitor print quality and identify defects such as insufficient paste, excess paste, bridging, smearing, and misalignment.
- Maintain proper solder paste handling and storage as per defined procedures.
- Perform first-piece verification before starting mass production.
- Make basic machine adjustments within authorized limits.
SPI Operation
- Operate the Solder Paste Inspection (SPI) machine.
- Verify solder paste volume, height, area, offset, and other programmed parameters.
- Monitor SPI results and identify printing-related defects.
- Inform the Production/Process/Quality Engineer about abnormalities.
- Maintain SPI inspection records and production data.
- Support troubleshooting and corrective actions for repeated solder paste defects.
SMT Reflow Oven Operation
- Operate and monitor the SMT reflow oven.
- Load and unload PCBs safely and correctly.
- Verify the correct reflow recipe/profile for the product.
- Monitor oven temperature zones, conveyor speed, and other process parameters.
- Ensure proper PCB flow through the reflow oven.
- Identify issues such as solder bridging, insufficient soldering, tombstoning, solder balls, and component displacement.
- Support reflow profiling activities with the Process Engineer.
- Ensure production is carried out according to approved process parameters.