04 Sep
|
SKILLVENTORY
|
India
04 Sep
SKILLVENTORY
India
Role & responsibilities
Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.
Analyze process performance data and identify prospects for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
Collaborate with Production, Quality, Maintenance, and R&D; teams to resolve process challenges and implement recent technologies or process upgrades.
📌 Slicing Process Engineering Wafer Jamnagar (India)
🏢 SKILLVENTORY
📍 India