06 Sep
|
Cyient
|
Bengaluru
About the Role
Cyient Semiconductor is seeking talented Analog Layout Engineers with solid experience in 28nm and higher technology nodes (40nm/55nm/65nm/90nm/180nm). The ideal candidate will have hands-on expertise in custom analog layout implementation, physical verification, and successful tape-out support for high-performance analog and mixed-signal IPs.
This role offers an excellent opportunity to work on complex analog circuits and advanced semiconductor products with leading global customers.
Key Responsibilities
- Develop high-quality custom analog and mixed-signal layouts from schematic to tape-out.
- Work on layout implementation for:
- Amplifiers
- Comparators
- Bandgap References
- LDOs
- PLLs
- ADC/DACs
- PMIC Blocks
- SerDes Analog Blocks
- Perform device matching, symmetry, shielding, and parasitic-aware layout techniques.
- Execute floorplanning and optimization to meet performance, area, and reliability requirements.
- Perform and resolve:
- DRC
- LVS
- ERC
- Antenna Checks
- Density Checks
- Collaborate closely with Analog Design, Verification, Reliability, and Foundry teams.
- Support post-layout extraction (PEX) activities and layout-related debugging.
- Drive layout closure and support tape-out activities.
- Ensure compliance with process design rules and reliability requirements.
Required Technical Skills
Layout Expertise
- Strong hands-on experience in Analog Custom Layout.
- Expertise in matching-sensitive layouts.
- Common-centroid layout techniques.
- Interdigitation techniques.
- Guard Rings, Shielding, Isolation methodologies.
- ESD and Latch-up aware layout practices.
Technology Node Experience Mandatory experience in one or more of the following nodes:
- 28nm
- 40nm
- 55nm
- 65nm
- 90nm
- 180nm
EDA Tools
- Cadence Virtuoso Layout XL
- Virtuoso ADE (Preferred)
- Calibre DRC/LVS/ERC
- Assura/PVS (Preferred)
Preferred Qualifications
- Experience in PMIC, Automotive, Consumer, Industrial, or High-Speed Analog products.
- Exposure to analog mixed-signal SoC environments.
- Experience supporting multiple tape-outs.
- Strong understanding of layout-dependent effects (LDE), electromigration (EM), and reliability considerations.
- Knowledge of FinFET technologies will be an added advantage.
Educational Qualification B.E / B.Tech / M.E / M.Tech in Electronics, ECE, Electrical Engineering, VLSI, Microelectronics, or related disciplines.
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