Role & responsibilities

* Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting defined thickness, TTV, bow, warp, and surface quality specifications.

* Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.

* Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.

* Investigate and troubleshoot process abnormalities including wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.

* Collaborate with Production, Quality, Maintenance, and R&D; teams to resolve process challenges and implement new technologies or process upgrades.

* Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.

* Conduct Root Cause Analysis (RCA) and implement Corrective and Preventive Actions (CAPA) for process deviations and quality issues.

* Develop, update, and maintain process documentation including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.

* Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.

* Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.

* Monitor and improve process capability (Cp/Cpk) through Statistical Process Control (SPC) and data-driven process management.

* Ensure compliance with safety,



environmental, quality, and operational standards across all slicing activities.

* Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.

* Support operator training and skill development by providing technical guidance and process-related coaching.

* Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.

Preferred candidate profile

* B.E./B.Tech in Mechanical Engineering.

* 2-7 years of relevant experience in industrial process engineering/manufacturing.

* Robust experience in designing, implementing, and optimizing industrial processes in a manufacturing setup.

* Candidates with experience in Diamond Wire Saw / Diamond Wire Slicing processes will be preferred.

* Good understanding of materials such as diamond wire and diamond tools, along with mechanics such as fluid movement and automation involved in silicon wafer manufacturing.

* Experience in Silicon Wafer manufacturing for semiconductor or solar applications will be preferred.

* Candidates from Solar, Semiconductor, Automobile Parts Machining, or other high-tech manufacturing industries will be preferred.

* Robust analytical and problem-solving skills with experience in engineering statistical methods and data analysis.

* Working knowledge of Microsoft Office and Minitab.

* Knowledge of ISO 9001, ISO 14001, ISO 45001, and ISO 50001.

* Knowledge of Six Sigma, QC Tools, Kaizen, Statistical Process Control (SPC), and TQM will be an added advantage.

* Excellent communication and interpersonal skills.

📌 Slicing Process Engineering - Wafer (Jamnagar)
🏢 SKILLVENTORY
📍 Jamnagar