JD for Technician

Position: Technician

Experience: 2 TO 5 Years

Required Technical Skills

- Hands-on experience in MMIC/MIC assembly and packaging.
- Valuable practical knowledge of:
- Die attachment / die bonding
- Wire bonding
- Gold wire and gold ribbon bonding
- Kovar plate attachment
- Alumina PCB/substrate attachment
- MMIC package assembly

- Experience in operating semi-automatic die bonding machines.
- Experience with wire bonding machines and associated tooling/fixtures.
- Ability to understand assembly drawings, dimensional drawings, process specifications, and work instructions.
- Knowledge of microscope-based inspection and basic bond-quality evaluation.
- Familiarity with ESD-controlled environments and clean handling of microwave/MMIC components.
- Knowledge of ISRO PAX standards/requirements and space-grade electronic assembly practices is highly desirable.

Qualification & Experience

- ITI / Diploma / equivalent technical qualification in Electronics, Electrical, Mechanical,



or a related discipline.
- 25 years of relevant hands-on experience in MMIC/MIC assembly, semiconductor packaging, RF/microwave assembly, or space-grade electronic assembly.
- Candidates with direct experience in die bonding, wire bonding, Kovar assembly, and Alumina substrate attachment will be preferred.

Preferred Experience

- Experience working on ISRO/space-related projects.
- Experience with ISRO PAX documentation and workmanship requirements.
- Experience in MIC/MMIC packaging and hermetic package assembly.
- Experience with semi-automatic die bonding and wire bonding equipment.
- Familiarity with gold ribbon bonding, thermosonic/thermocompression bonding, and related assembly processes.
- Ability to work in a controlled production environment with high attention to precision and workmanship.

📌 Technician - MMIC (Bengaluru)
🏢 Ananth Technologies
📍 Bengaluru