Wet Process Engineer Semiconductor Wafer Fabrication

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Experience: 6 -15 Years

Role Overview

We are seeking an experienced Wet Process Engineer to develop, optimize, qualify, and sustain wet chemical processing operations within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing robust wafer cleaning, chemical treatment, surface preparation, oxide removal, and contamination control processes that enable high-yield semiconductor manufacturing and world-class device reliability.

The successful candidate will work closely with Lithography, Etch, CMP, Thin Film, Diffusion, Ion Implant, Process Integration, Equipment Engineering, Yield Engineering, Manufacturing, Metrology, Facilities, and Quality teams to optimize wet processes, reduce defects, improve wafer cleanliness, and support technology transfer and production ramp-up.

Candidates should possess strong expertise in wet chemistry, wafer cleaning, chemical compatibility, contamination control, defect reduction, process optimization, and Statistical Process Control (SPC).

Role Objectives

- Develop world-class wafer cleaning and wet chemical processes.
- Minimize contamination and particle-related yield losses.
- Improve wafer surface quality and process consistency.
- Support technology transfer and production ramp.
- Deliver repeatable, scalable, and stable wet processing operations.

Key Responsibilities
- Develop, optimize, and sustain wet process manufacturing operations for semiconductor wafer fabrication.
- Establish process windows for wafer cleaning, oxide removal, surface conditioning, chemical etching, and post-process cleaning.
- Optimize RCA cleaning, HF cleaning, SC-1, SC-2, ozone cleaning, sulfuric peroxide cleaning, and solvent cleaning processes.
- Develop pre-diffusion, pre-oxidation, pre-deposition, post-etch, post-CMP, and post-implant cleaning methodologies.
- Optimize process chemistry, chemical concentration, bath temperature, rinse cycles, and drying parameters.
- Reduce contamination from particles, metallic impurities, organics, native oxides, and residues.
- Perform Design of Experiments (DOE) to improve process capability and wafer cleanliness.
- Analyze particle monitoring data, defect inspection reports, surface characterization, and yield trends.
- Collaborate with CMP, Etch, Thin Film, Lithography, and Process Integration teams to optimize upstream and downstream process compatibility.
- Support qualification of new cleaning chemistries, process chemicals, and consumables.
- Work with Equipment Engineering to improve wet bench performance,



chemical delivery systems, and equipment reliability.
- Support installation, qualification, and acceptance of wet processing equipment.
- Utilize Statistical Process Control (SPC) methodologies to monitor process stability and capability.
- Perform root cause analysis for contamination events, process excursions, and yield losses.
- Develop engineering specifications, operating procedures, and process documentation.
- Participate in technology transfer and Current Product Introduction (NPI) activities.
- Improve manufacturing yield, cycle time, throughput, and process efficiency.
- Ensure compliance with semiconductor quality systems, chemical handling procedures, cleanroom protocols, and EHS regulations.
- Drive Lean Manufacturing and continuous improvement initiatives.

Key Responsibilities During Fab Startup
- Support installation and qualification of wet process equipment.
- Develop baseline wafer cleaning recipes for manufacturing.
- Establish contamination control methodologies and qualification procedures.
- Define chemical process specifications and process control plans.
- Qualify cleaning chemicals, DI water systems, filters, and consumables.
- Support engineering builds, pilot production, and technology transfer.
- Develop manufacturing SOPs and engineering documentation.
- Train manufacturing personnel on wet process operations and chemical safety.
- Improve process capability before production ramp.
- Support high-volume manufacturing readiness.

Required Qualifications
- Bachelor's or Master's degree in Chemical Engineering, Materials Science, Electronics Engineering, Electrical Engineering, Chemistry, Physics, Semiconductor Engineering, or related discipline.
- 6 15 years of semiconductor wafer fabrication experience.
- Robust expertise in wet process engineering and semiconductor cleaning technologies.
- Experience supporting advanced semiconductor manufacturing.
- Proven expertise in process optimization, contamination control, and yield improvement.
- Excellent analytical, troubleshooting, and communication skills.

Technical Skills Semiconductor Manufacturing
- Semiconductor Wafer Fabrication
- Front-End Manufacturing (FEOL)
- CMOS Process Technology
- High Volume Manufacturing (HVM)
- Semiconductor Process Development




- Technology Transfer
- Process Qualification
- New Product Introduction (NPI)

Wet Process Technologies
- Wafer Cleaning
- Wet Chemical Processing
- Surface Preparation
- Surface Conditioning
- Native Oxide Removal
- Chemical Etching
- Post-Etch Cleaning
- Post-CMP Cleaning
- Post-Implant Cleaning
- Particle Removal
- Metallic Contamination Removal
- Organic Contamination Removal
- Residue Removal
- Surface Passivation
- Wafer Drying

Wet Chemistry
- RCA Clean
- SC-1 Clean
- SC-2 Clean
- Dilute HF (DHF)
- Buffered Oxide Etch (BOE)
- Hydrofluoric Acid (HF)
- Sulfuric Peroxide Mixture (SPM)
- Ammonium Hydroxide (NH OH)
- Hydrochloric Acid (HCl)
- Hydrogen Peroxide (H O )
- Ozone Cleaning
- Megasonic Cleaning
- DI Water Processing
- IPA Drying
- Marangoni Drying

Wet Process Equipment Experience With Leading Semiconductor Wet Process Equipment Such As

- SCREEN Semiconductor Solutions
- TEL Clean Track Systems
- SEMES Wet Processing Systems
- Modutek Wet Benches
- AP&S; Cleaning Systems
- ACM Research Wet Cleaning Systems
- MEI Wet Process Equipment

Process Engineering
- Design of Experiments (DOE)
- Statistical Process Control (SPC)
- Process Capability (Cp/Cpk)
- Root Cause Analysis
- FMEA
- Yield Improvement
- Defect Reduction
- Contamination Control
- Process Characterization
- Chemical Compatibility

Metrology
- Particle Inspection
- Surface Particle Measurement
- Defect Inspection
- Optical Inspection
- Surface Profilometry
- Contact Angle Measurement
- TOC Monitoring
- Resistivity Monitoring
- Surface Cleanliness Verification
- Chemical Concentration Monitoring

Data Analysis
- JMP
- Python
- MATLAB
- SQL
- Microsoft Excel
- Statistical Analysis
- Data Visualization

Cross Functional Collaboration The Wet Process Engineer Will Work Closely With

- Process Integration Engineering
- Lithography Engineering
- Etch Engineering
- CMP Engineering
- Thin Film Engineering
- Diffusion Engineering
- Ion Implant Engineering
- Equipment Engineering
- Yield Engineering
- Manufacturing Engineering
- Metrology Engineering
- Facilities Engineering (UPW & Chemical Systems)
- Product Engineering
- Failure Analysis
- Quality Engineering
- Automation Engineering

Preferred Industry Experience Experience In Semiconductor Manufacturing For

- Logic Devices
- Memory Devices
- Foundry Manufacturing
- Analog & Mixed-Signal ICs
- Power Semiconductor Devices
- RF Technologies
- Advanced CMOS Manufacturing

Candidates with experience in greenfield semiconductor fab startups, advanced technology nodes (28nm and below), or high-volume manufacturing environments are highly preferred.

📌 Wet Process Engineer – Semiconductor Wafer Fabrication (Ahmedabad)
🏢 Best NanoTech
📍 Ahmedabad