Package Design Engineer (Bengaluru)

Package Design Engineer (Bengaluru)

10 Sep
|
tylsemi
|
Bengaluru

10 Sep

tylsemi

Bengaluru

Role Overview
TYLsemi is seeking a Package Design Engineer to own design of IC packages (flip-chip, wirebond and 2.5D/interposer platforms) for high-speed digital and data-center-class products. The successful candidate will drive package design from bump/ball map definition through substrate stack-up, routing, signal/power integrity closure, and tapeout — working closely with SI/PI, silicon design, and test engineering to deliver package designs that are robust against real silicon feedback.

What You’ll Do
Own end-to-end package design in Cadence Allegro Package Designer (APD) for design feasibility studies through tapeout: bump/UBM mapping, ball map planning, substrate stack-up definition, and fan-out/escape routing.
Route and close high-speed signal nets (e.g. Parallel interfaces such as UCIe, LPDDR/DDR; SerDes interfaces such as PCIe, Ethernet and UFS) using controlled-impedance and length-matching techniques.
Design and optimize power delivery networks (PDN) for IC package, including plane splits, decoupling strategy, and via stitching.




Partner with SI/PI engineering - use SIPI feedback to iterate and harden the package design.
Drive DRC/DFM closure with substrate vendors; manage design review cycles through tapeout.
Collaborate cross-functionally with mechanical/thermal/reliability engineering on warpage, CTE mismatch, and underfill selection for package robustness.
Document design decisions, stack-up specifications, and via schedules for design reuse and knowledge transfer.

Must Have Skills
Proficiency in Cadence Allegro Package Designer (APD) and associated package layout tools (bump/ball map planning, substrate routing, stack-up definition) for flip-chip/wirebond packaging.
Demonstrated ability to close package designs against SIPI (signal integrity / power integrity) feedback loops — iterating stack-up, routing, and PDN design based on simulation and/or lab correlation results.
Solid fundamentals in high-speed digital signal integrity (impedance control,

📌 Package Design Engineer (Bengaluru)
🏢 tylsemi
📍 Bengaluru

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