JD for Technician

Position: Technician

Experience: 2 TO 5 Years

Required Technical Skills
Hands-on experience in MMIC/MIC assembly and packaging.
Valuable practical knowledge of:
Die attachment / die bonding
Wire bonding
Gold wire and gold ribbon bonding
Kovar plate attachment
Alumina PCB/substrate attachment
MMIC package assembly
Experience in operating semi-automatic die bonding machines.
Experience with wire bonding machines and associated tooling/fixtures.
Ability to understand assembly drawings, dimensional drawings, process specifications, and work instructions.
Knowledge of microscope-based inspection and basic bond-quality evaluation.
Familiarity with ESD-controlled environments and clean handling of microwave/MMIC components.
Knowledge of ISRO PAX standards/requirements and space-grade electronic assembly practices is highly desirable.

Qualification & Experience
ITI / Diploma / equivalent technical qualification in Electronics, Electrical, Mechanical,



or a related discipline.
25 years of relevant hands-on experience in MMIC/MIC assembly, semiconductor packaging, RF/microwave assembly, or space-grade electronic assembly.
Candidates with direct experience in die bonding, wire bonding, Kovar assembly, and Alumina substrate attachment will be preferred.

Preferred Experience
Experience working on ISRO/space-related projects.
Experience with ISRO PAX documentation and workmanship requirements.
Experience in MIC/MMIC packaging and hermetic package assembly.
Experience with semi-automatic die bonding and wire bonding equipment.
Familiarity with gold ribbon bonding, thermosonic/thermocompression bonding, and related assembly processes.
Ability to work in a controlled production setting with high attention to precision and workmanship.

📌 Technician Mmic Bengaluru (India)
🏢 Ananth Technologies
📍 India