Package Reliability Engineer (Sanand)

Package Reliability Engineer (Sanand)

16 Sep
|
Micron
|
Sanand

16 Sep

Micron

Sanand

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., you will contribute significantly to assuring the outstanding quality and durability of Micron’s products. This distinctive position allows you to coordinate package qualification for new products and innovative builds, materials, and processes. Your insights will influence product release recommendations derived from package reliability test data, enabling Micron to compete worldwide.
You will develop reliability test plans to evaluate risks related to excursions, conversions, and qualification concerns. Additionally, you will manage root cause analysis and corrective measures within the GQ department for package-related qualification failures and RMAs, preparing detailed reports for review.



Cooperation is essential as you offer assistance to internal and external customers regarding package-related quality and reliability matters, addressing customer inquiries promptly.
Job Responsibilities
- Coordinate package qualification efforts for new products and cutting-edge builds
- Offer suggestions regarding product launch grounded in reliability test outcomes
- Develop reliability test plans to evaluate risk related to excursions, conversions, and qualification issues
- Coordinate root cause analysis and corrective action efforts within the GQ department for qualification failures and RMAs
- Prepare detailed reports for discussion
- Offer assistance to internal and external customers regarding package-related quality and reliability concerns

Successful Candidates Will Have
- Detailed understanding of semiconductor component package assembly processes and challenges
- Understanding of surface m

📌 Package Reliability Engineer (Sanand)
🏢 Micron
📍 Sanand

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