Company:
Qualcomm India Private Limited

Job Area:
Engineering Group, Engineering Group > Packaging Engineering

General Summary:
Role Overview
We are seeking an
IC Package Design Engineer
to support the
planning, coordination, and execution of IC package design activities
across complex semiconductor product development programs.

This role emphasizes
program execution, cross‑functional coordination, and delivery predictability
, supporting package design efforts from
early feasibility and design planning through tapeout and manufacturing readiness
. The engineer will collaborate closely with
package designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams
to ensure alignment, issue tracking, and timely delivery of package milestones.

EDA tools and automation are used primarily as
enablers of execution
, while the core focus of this role is on
driving clarity, managing dependencies, and reducing execution risk
.

Minimum Qualifications:
Bachelor's degree in Chemical Engineering, Electrical Engineering,



Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Key Responsibilities
Program Execution & Coordination (Primary Focus)
Support execution of IC package design programs from early design planning through tapeout and post‑tapeout support.
Develop and maintain execution plans, schedules, task lists, and milestone trackers.
Track risks, issues, dependencies, and action items across package design, verification, and manufacturing activities.
Drive action item follow‑up, escalation, and closure with explicit ownership and timelines.
Prepare and deliver sta

📌 Senior Engineer Bengaluru
🏢 Qualcomm
📍 Bengaluru