SI/PI, Package and Power Delivery Engineers (Bengaluru)

SI/PI, Package and Power Delivery Engineers (Bengaluru)

18 Sep
|
tylsemi
|
Bengaluru

18 Sep

tylsemi

Bengaluru

About Tylsemi
Tylsemi is building and scaling high-impact semiconductor operations. We partner across design, manufacturing, and supply chain to bring silicon from concept to high-volume production with speed, quality, and predictable execution.
Role Overview
As an SI/PI, Package and Power Delivery Engineer at Tylsemi, you will own signal integrity, power integrity, and package/PDN co-design across chip, package, and board interfaces. You will work closely with SoC, physical design, analog, package, board, and validation teams to ensure robust high-speed links, stable power delivery, and predictable signoff from early architecture through tapeout and bring-up. This role is open across experience levels (5–20 years) and is ideal for engineers who enjoy cross-domain problem solving and turning complex electrical constraints into clean, manufacturable solutions.
What You’ll Do
- Drive SI/PI methodology and execution from early planning through signoff for high-speed interfaces and power delivery networks
- Perform package/board/chip co-design: define stackups, routing constraints,



via strategies, reference planes, and return-path integrity
- Model and analyze high-speed channels (e.g., SerDes, DDR, PCIe, USB, Ethernet) including insertion/return loss, crosstalk, jitter, eye margins, and equalization tradeoffs
- Build and validate electrical models (IBIS/IBIS-AMI, S-parameters, SPICE) and ensure model correlation and version control hygiene
- Own PDN design and analysis across die/package/board: impedance targets, decap strategy, anti-resonance mitigation, and rail stability
- Run PI signoff including DC/AC IR drop, EM, dynamic droop/noise, and power/ground bounce; drive fixes with explicit, reviewable action plans
- Partner with physical design and signoff teams on power grid architecture, bump/ball planning, current density limits, and rail partitioning
- Collaborate with package engineering on substrate routing, escape, ballout, and manufacturability constraints; review

📌 SI/PI, Package and Power Delivery Engineers (Bengaluru)
🏢 tylsemi
📍 Bengaluru

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