Our vision is to transform how the world uses information to enrich life for
all
.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Advanced Packaging Technology Development (APTD) at Micron Technology, Inc. is hiring a Process Simulation Engineer with strong technical expertise. The role involves process and equipment simulations for advanced semiconductor packaging, including HBM products, focusing on all aspects of packaging technology and their interactions. Collaboration with design, characterization, assembly R&D;, and process teams is required.
Responsibilities
Partner with process engineering teams to understand semiconductor packaging processes and develop robust
FEA, solid & flow simulations, and analytical simulation models
.
Guide
test vehicle development
to improve simulation correlation with empirical data; develop test plans as needed to verify models and validate analysis approaches against test outcomes.
Participate in the development and advancement of
simulation modeling methodologies
across
structural, thermo‐structural, flow, thermal, and other multiphysics domains
.
Perform
structural, thermal, and flow simulations
for semiconductor packaging processes to predict behavior, assess risks, and enhance process and product performance.
Provide
process and equipment simulation reports
to support
pathfinding, technology development, and product introduction
.
Communicate
FEA and flow simulation results (preferably demonstrating CFD) analysis results
clearly to process engineers, providing actionable
technical insights, design recommendations, and risk assessments
.
Mentor and mature interpersonal
analysis capability
across
structural, thermal, and flow technology domains
.
Requirements
Strong informative background or hands‐on experience in
proven mechanics, finite element methods (FEA) with expertise in multiphysics modeling and simulation. Good understandings of fluid mechanics, thermodynamics, heat & mass transfer, kinetics, computational fluid dynamics (CFD) would be useful.
Proven ability to
understand and model multiphysics interactions
,



including setting up integrated multiphysics frameworks for
analysis, measurements, and validation
in IC packaging and related areas.
Proven foundation in
mechanics, physics, and chemistry
, with emphasis on both
analytical methods and measurement techniques
.
Extensive experience with
high‐fidelity FEA
including
static, multifaceted, thermal, flow, and coupled multiphysics analyses
.
Experience in static/ energetic/ thermal analysis and multi-physics modeling with ability to handle convergence issues due to large deformations, large strains, plasticity, creep, viscoplasticity, viscoelasticty and contact.
In‐depth knowledge of
material properties, material characterization techniques, fatigue life prediction, creep damage assessment, and measurement methods
relevant to IC packaging.
Proficiency in commercial simulation tools such as
, Ansys Mechanical, APDL, ACT, DesignModeler, and SpaceClaim
with experience in
CAD tools (AutoCAD, SolidWorks)
. Knowledge of working with
Ansys Fluent or Star‐CCM+ would be beneficial.
Strong understanding of
semiconductor packaging processes, materials, and technology trends
, including but not limited to
dicing, backgrinding, die attach, PECVD, cryogenic cleaning, organic substrates, over‐molding materials, wire‐bonding, and C4 / Cu pillar attachment methods
.
Ability to
understand failure mechanisms
and develop both
analytical and FE‐based models
to explain and predict failure modes.
Experience in
defining and driving numerical and/or laboratory experiments
to evaluate feasibility and validate concepts and solutions for
new package technology development
.
Strong inclination toward
demonstrating AI/ML techniques
to reduce simulation iterations, accelerate convergence, and improve modeling efficiency.
Ability to
turn simulation outcomes into scalable, easy‐to‐use tools or workflows
for broader engineering adoption.




Excellent
oral and written communication skills
, with the ability to collaborate optimally in
multi-functional, multidisciplinary team environments
.
Educational Qualification:
MS/M.Tech with 6 Years or PhD with 1 to 2 years' experience
Mechanical Engineering, Materials Engineering, Physics, or related field
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life
for all
. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations,
please contact
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Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert
:
Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
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📌 Senior/Staff Engineer Process Simulations Aptd (India)
🏢 Micron
📍 India