Position: Technical Lead- BSP, Hypervisior, Kernal, Boot Loader (TK712FT RM 4430)

MANDATORY SKILLS : Automotive, Defect Ananlysis, Bug Fixing, BSP, Kernal, HyperV, Boot Loader

Role Overview

This role is for an Automotive BSP Engineer with strong hands-on experience in BSP, Kernel, Hypervisor, and Bootloader development. The candidate should be able to work on low-level platform software, board bring-up, debugging, integration, and issue resolution for automotive embedded systems. Experience in Linux, QNX, or Android-based automotive platforms will be preferred.

Key Responsibilities

- Work on BSP, Kernel, Hypervisor, and Bootloader development activities for automotive platforms.
- Support board bring-up, software flashing, system boot, and platform integration activities.
- Develop, debug, and integrate low-level software components, device drivers, and platform interfaces.
- Analyze and resolve issues related to kernel, bootloader, hypervisor, drivers, and board-level software.
- Work closely with internal teams, customer teams, and system integration teams for technical issue resolution.
- Maintain requirement updates, defect tracking, and technical documentation as per project needs.
- Participate in technical discussions, sprint planning, reviews, and customer calls related to BSP/platform software.

Required Technical Skills

- 7 to 12 years of experience in automotive embedded software development.




- Strong hands-on experience in BSP development and board bring-up.
- Good knowledge of Kernel development, configuration, debugging, and platform integration.
- Experience in Bootloader development, flashing, boot sequence analysis, and boot issue debugging.
- Working knowledge of Hypervisor concepts, integration, and debugging in automotive platforms.
- Experience in low-level device drivers and interfaces such as I2C, SPI, UART, CAN, GPIO, and Ethernet.
- Exposure to Linux, QNX, or Android/AOSP-based automotive platform software.
- Valuable debugging and root-cause analysis skills for board-level and platform-level issues.
- Automotive domain experience in infotainment, cockpit, telematics, ADAS, or connected vehicle platforms is preferred.
- Experience in requirement tracking, defect management, Agile execution, and technical documentation.

Preferred SoC / Platform Exposure

- Qualcomm Snapdragon Automotive platforms: SA8155P, SA8295P, SA8775P, SA8650P, SA8620P, SA8255P, SA7255P.
- Qualcomm embedded/edge AI platforms: QCS6490, QCS8250, QCS8550, QRB5165.
- Samsung Exynos Auto platforms: Exynos Auto V9, Exynos Auto V7, Exynos Auto T5123.
- Additional relevant SoC exposure: Snapdragon Cockpit, Snapdragon Ride, Qualcomm Automotive Development Platform, Samsung Exynos-based automotive or embedded platforms.

📌 Technical Lead- BSP, Hypervisior, Kernal, Boot Loader (Pune)
🏢 Randstad Sourceright
📍 Pune