Service Engineer – Die Bonder / Semiconductor Equipment

About HCP Technologies Pvt. Ltd.

HCP Technologies Private Limited is a capital equipment supplier and OEM representation company founded in February 2024, headquartered in JP Nagar, Bengaluru. We represent over 32 global OEM brands across a wide range of high-growth verticals — Semiconductor, Additive Manufacturing, Photonics, Electronics Manufacturing (EMS), Battery Energy Storage Systems (BESS)/EV, and IoT/AI/ML.

We serve a diverse base of clients including IITs, IISc, CSIR, and ISRO, alongside leading private-sector manufacturers across India. Our team brings deep domain expertise — over 14 years of collective experience in capital equipment sales and marketing — to help customers access cutting-edge global technology.

Position: Service Engineer

We are looking for a Service Engineer with hands-on experience servicing Die Bonders or similar semiconductor assembly/packaging equipment (e.g., Wire Bonders, Pick-and-Place systems).

:

- Install and commission Die Bonders and related semiconductor back-end equipment at customer sites across India
- Perform routine preventive maintenance, calibration, and performance checks
- Diagnose and troubleshoot mechanical, electrical, and software-related faults
- Provide prompt breakdown support to minimize customer downtime




- Liaise with global OEM principals for technical escalation, spares procurement, and firmware/software updates
- Train customer operators and maintenance staff on proper equipment usage and basic troubleshooting
- Maintain accurate service records, reports, and spare parts inventory tracking
- Support pre-sales technical demonstrations when required

Requirements:

- Diploma/B.E. in Electronics, Mechatronics, Instrumentation, or related field
- Proven hands-on experience servicing Die Bonders, Wire Bonders, or similar semiconductor packaging/assembly equipment
- Solid troubleshooting skills across mechanical, electrical, and software systems
- Willingness to travel extensively for site visits across India
- Good communication skills for customer-facing interactions

Why Join HCP Technologies? Join a growing team supporting some of India's most advanced semiconductor and electronics manufacturing facilities, with direct exposure to leading global OEM technology and a real opportunity to build deep technical expertise in a high-growth sector.

? Interested candidates can apply directly or send their resume to [email protected]

. Feel free to tag or share with someone who'd be a great fit!

- #Hiring #ServiceEngineer #DieBonder #Semiconductor #FieldService #JobOpening #HCPTechnologies

📌 Service Engineer (Bengaluru)
🏢 HCP Technologies Private
📍 Bengaluru