- Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.
- Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
- Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
- Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
- Collaborate with Production, Quality, Maintenance, and R&D; teams to resolve process challenges and implement recent technologies or process upgrades.