Pod 6 — Linux — Lead
Pod / Track Pod 6 — Linux
Role Title Lead — Linux Kernel & BSP
Experience 8 – 10 years
Primary Location Hyderabad, India (Transition phase); HCLTech Offshore Delivery Center thereafter
Work Model Physical co-location at Hyderabad mandatory during Transition (Month 1–3) for knowledge transfer and hardware/lab access; delivery shifts to HCLTech's Offshore Delivery Center (ODC) from Shadow (Month 4–6) onward.
Role Summary
Own Linux kernel and BSP sustenance — version upgrades, device-tree maintenance, upstream kernel.org contribution, and kernel driver defect resolution across the platform.
Key Responsibilities
- Sustain the kernel, device tree, and board support package.
- Own the HLOS boot hand-off from the bootloader/Coretech layer through kernel initialization.
- Tune kernel-level performance — memory footprint and boot-time optimization — and support OTA integration at the kernel/HLOS layer.
- Manage kernel version upgrade cycles across platform releases.
- Upstream patches to kernel.org and vendor Linux trees, aligned with the platform's upstream-first open-source direction.
- Triage kernel panics and crash dumps.
- Maintain the kernel security-patch cadence and CVE response process.
- Mentor the pod's Senior Engineers on kernel debugging and upstream contribution practice.
Must-Have Skills
- 8–10 years Linux kernel engineering.
- Linux kernel internals.
- Device tree authoring.
- Upstream kernel contribution process (kernel.org).
- Kernel debugging (kdump/crash).
- Security patch triage and CVE response.
- Yocto/OpenEmbedded HLOS build experience; boot-time and memory performance profiling.
Good-to-Have Skills
- Upstream kernel.org maintainership or a significant patch history.
- Yocto/OpenEmbedded layer maintenance.
- Real-time kernel (PREEMPT_RT) experience.
- Embedded security-patching automation tooling.
- OTA update integration experience at the kernel/HLOS layer.
Key Responsibilities
Pod 6 — Linux — Lead
Pod / Track Pod 6 — Linux
Role Title Lead — Linux Kernel & BSP
Experience 8 – 10 years
Primary Location Hyderabad, India (Transition phase); HCLTech Offshore Delivery Center thereafter
Work Model Physical co-location at Hyderabad mandatory during Transition (Month 1–3) for knowledge transfer and hardware/lab access; delivery shifts to HCLTech's Offshore Delivery Center (ODC) from Shadow (Month 4–6) onward.
Role Summary
Own Linux kernel and BSP sustenance — version upgrades, device-tree maintenance, upstream kernel.org contribution, and kernel driver defect resolution across the platform.
Key Responsibilities
- Sustain the kernel, device tree, and board support package.
- Own the HLOS boot hand-off from the bootloader/Coretech layer through kernel initialization.
- Tune kernel-level performance — memory footprint and boot-time optimization — and support OTA integration at the kernel/HLOS layer.
- Manage kernel version upgrade cycles across platform releases.
- Upstream patches to kernel.org and vendor Linux trees, aligned with the platform's upstream-first open-source direction.
- Triage kernel panics and crash dumps.
- Maintain the kernel security-patch cadence and CVE response process.
- Mentor the pod's Senior Engineers on kernel debugging and upstream contribution practice.
Must-Have Skills
- 8–10 years Linux kernel engineering.
- Linux kernel internals.
- Device tree authoring.
- Upstream kernel contribution process (kernel.org).
- Kernel debugging (kdump/crash).
- Security patch triage and CVE response.
- Yocto/OpenEmbedded HLOS build experience; boot-time and memory performance profiling.
Positive-to-Have Skills
- Upstream kernel.org maintainership or a significant patch history.
- Yocto/OpenEmbedded layer maintenance.
- Real-time kernel (PREEMPT_RT) experience.
- Embedded security-patching automation tooling.
- OTA update integration experience at the kernel/HLOS layer.
Skill Requirements
Other Requirements
📌 Senior Technical Architect (India)
🏢 HCLTech
📍 India
Reply to this offer
Impress this employer describing Your skills and abilities, fill out the form below and leave Your personal touch in the presentation letter.