Areas Of Responsibility

Skills: Firmware, Embedded C, C++, OpenBMC, OBMF-ICP, PLDM
OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

Key Skills: OCP DC-SCM/DC-MHS, USB

Experience

1 - 5 years of experience
Expert embedded C,



solid C++
BMC / platform-management firmware experience (OpenBMC strongly preferred)
DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
Yocto/BitBake, CMake/Meson, Git, CI
Understanding of I2C/SMBus, SPI, UART, USB, GPIO
Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics

📌 Firmware Engineer Usb & Openbmc Req Bengaluru
🏢 TESSOLVE
📍 Bengaluru