- Primary Location: Hyderabad, India (Transition phase); HCLTech Offshore Delivery Center thereafter
- Work Model: Physical co-location at Hyderabad mandatory during Transition (Month 1-3) for knowledge transfer and hardware/lab access; delivery shifts to HCLTech's Offshore Delivery Center (ODC) from Shadow (Month 4-6) onward.
Role Summary
Execute power, performance and thermal profiling and tuning tasks, reporting to the Pod Lead.
Key Responsibilities
- Execute power, performance, and thermal profiling against baseline.
- Support thermal hot-spot identification and measurement across the SoC package.
- Triage power/thermal regressions introduced by firmware or driver changes.
- Support DVFS and thermal-mitigation policy tuning.
- Contribute to power/thermal characterization reports for customer reviews.
Must-Have Skills
- 5-8 years SoC power/performance engineering.
- Power profiling tooling.
- DVFS / thermal governor tuning.
- Performance benchmarking methodology.
- Statistical analysis of power/thermal data.
- Thermal hot-spot identification and remediation methodology.
Positive-to-Have Skills
- Thermal simulation tooling (e.g. Icepak or equivalent).
- ML-assisted DVFS tuning experience.
- Experience presenting power/thermal data directly to customer stakeholders.
Skill RequirementsOther Requirements
📌 Senior Design Lead (India)
🏢 HCL Technologies
📍 India
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