Role Overview

We are seeking an experienced Physical Design Manager to lead Physical Design and CAD teams responsible for end-to-end ASIC/SoC physical implementation.

The role requires solid technical depth in full-chip Physical Design, advanced technology nodes, STA/timing closure, physical signoff, low-power implementation, and tapeout , combined with proven people-management experience. The position will work closely with Architecture, RTL, DFT, Analog/Mixed-Signal, Packaging, and Program Management teams.

Key Responsibilities

- Lead and manage Physical Design and CAD teams across multiple locations.
- Own end-to-end ASIC/SoC physical implementation from netlist to GDSII/tapeout.
- Drive floorplanning, power planning, placement, optimization, CTS, routing, and post-route optimization.
- Lead STA and timing closure across multiple modes and corners.
- Drive physical signoff including signal integrity, IR drop, electromigration (EM), DRC, LVS, and low-power verification .
- Provide technical direction for complex advanced-node ASIC/SoC designs .
- Lead implementation of low-power architectures , including DVFS, power gating, multi-voltage domains, UPF/CPF, and power-aware flows.
- Collaborate with Architecture, RTL, DFT, Analog/Mixed-Signal, Packaging, and Program Management teams to resolve implementation and integration issues.
- Drive EDA methodology, flow development, automation, and tool optimization using Synopsys and/or Cadence platforms.
- Review design quality, implementation metrics, timing, power, area, congestion, and signoff readiness.
- Support advanced packaging and chiplet-based implementation flows where applicable.
- Mentor technical leads and engineers, manage team capacity,



and drive execution against project and tapeout schedules.

Required Qualifications
- B.Tech / M.Tech in Electronics, Electrical Engineering, VLSI, Microelectronics , or a related discipline.
- 12–20 years of experience in ASIC/SoC Physical Design and physical implementation.
- Strong experience in STA, timing closure, and physical signoff .
- People management experience is mandatory.
- Minimum 2+ years of experience in a senior management, engineering management, or director-level role .
- Proven ownership of full-chip implementation and successful ASIC/SoC tapeouts .
- Hands-on experience with advanced semiconductor technology nodes .
- Strong understanding of low-power and multi-voltage SoC implementation.
- Experience managing technically complex projects and cross-functional engineering teams.

Technical Skills

Physical Design

- ASIC/SoC Physical Design
- Floorplanning and Power Planning
- Placement and Optimization
- Clock Tree Synthesis (CTS)
- Routing and Post-Route Optimization
- Full-Chip Physical Implementation
- PPA Optimization
- Congestion Analysis

Timing & Signoff

- Static Timing Analysis (STA)
- Multi-Mode Multi-Corner (MMMC) Analysis
- Timing Closure
- Signal Integrity / Crosstalk
- IR Drop and Electromigration (EM)
- DRC / LVS
- Physical Verification and Signoff

Low-Power Design

- UPF / CPF
- DVFS
- Power Gating
- Multi-Voltage Domains
- Low-Power Implementation and Verification

EDA Tools

- Synopsys Physical Design / Signoff Tool Suite
- Cadence Physical Design / Signoff Tool Suite
- EDA Flow Development and Optimization
- Physical Design Automation

Advanced Technologies

- Advanced Process Nodes
- High-Speed Interface Implementation
- Advanced Packaging
- Chiplet-Based Architectures
- Multi-Die Integration

📌 Physical Design Manager (Bengaluru)
🏢 Best NanoTech
📍 Bengaluru