MGR II – R&D Product Development (PCB Design) (Bengaluru)

MGR II – R&D Product Development (PCB Design) (Bengaluru)

01 Oct
|
TE Connectivity
|
Bengaluru

01 Oct

TE Connectivity

Bengaluru

About the Role

We are is seeking an experienced and highly motivated Manager II – R&D; / Product Development Engineering (PCB Design) to lead a team of PCB engineers responsible for designing and developing high-performance electronic hardware solutions. This role will drive innovation in high-speed interconnect technologies, mentor engineering talent, and collaborate with global cross-functional teams to deliver world-class products.

Key Responsibilities

- Lead the design and development of high-speed, RF, and multilayer PCBs for advanced connectivity products.

- Provide technical leadership on Signal Integrity (SI), Power Integrity (PI), Design for Manufacturing (DFM), and PCB design best practices.

- Drive PCB design reviews, quality improvements, and engineering excellence across projects.

- Mentor, coach, and develop engineering teams while fostering a culture of innovation and collaboration.

- Collaborate closely with global R&D;, Mechanical, Signal Integrity, Manufacturing, and Product Management teams.

- Ensure project execution aligns with product requirements, quality standards, timelines, and business objectives.

- Support continuous improvement initiatives, design standardization, and process optimization.

- Participate in technical problem-solving and root-cause analysis for complex hardware challenges.

Required Qualifications

- Bachelor's or Master's degree in Electronics,



Electrical Engineering, or a related discipline.

- 15+ years of experience in PCB Design, Hardware Development, or Product Engineering.

- Strong expertise in High-Speed PCB Design, Multilayer PCB Design, and RF PCB Design.

- Hands-on experience with PCB design tools such as Cadence Allegro and/or Altium Designer.

- Good understanding of Signal Integrity (SI), Power Integrity (PI), and Design for Manufacturing (DFM).

- Proven experience leading and managing engineering teams.

- Strong communication, stakeholder management, and collaboration skills.

- Experience working in a global product development workplace.

Preferred Qualifications

- Experience in connectivity, networking, data communication, or high-speed interconnect products.

- Exposure to product lifecycle management and new product development processes.

- Experience working with global engineering teams and customers.

- Knowledge of PCB manufacturing, assembly, and validation processes.

Key Skills

- PCB Design & Development

- High-Speed PCB Design

- RF PCB Design

- Multilayer PCB Design

- Cadence Allegro

- Altium Designer

- Signal Integrity (SI)

- Power Integrity (PI)

- Design for Manufacturing (DFM)

- Hardware Product Development

- Engineering Leadership

- Team Management

- Cross-Functional Collaboration

📌 MGR II – R&D Product Development (PCB Design) (Bengaluru)
🏢 TE Connectivity
📍 Bengaluru

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