Silicon Packaging Design Engineer (Bengaluru)

Silicon Packaging Design Engineer (Bengaluru)

01 Oct
|
Intel
|
Bengaluru

01 Oct

Intel

Bengaluru

Job Details:

Job Description:
Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel's innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel's next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and skilled growth.

Key Responsibilities
- Drive the complete development of substrate designs, starting from initial concept through tapeout.
- Perform physical layout and routing of package designs, ensuring adherence to design requirements.
- Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.




- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.

Qualifications:
Minimum Qualifications
- Diploma in Electronic/ Electrical Engineering or a related field.
- six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
- Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
- Basic understanding of I/O fundamentals, package interconne

📌 Silicon Packaging Design Engineer (Bengaluru)
🏢 Intel
📍 Bengaluru

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