Sr. Packaging Engineer (Hyderabad)

Sr. Packaging Engineer (Hyderabad)

01 Oct
|
Semtech
|
Hyderabad

01 Oct

Semtech

Hyderabad

Responsibilities:

· Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio. (25%)
· OSAT Partner Management: Serve as a technical interface with external assembly and test (OSAT) partners, supporting process capability improvements, applying established design rules, and helping ensure adherence to package specifications and quality standards across international manufacturing sites. (15%)
· Reliability Qualification: Support the development and execution of package-level reliability qualification plans in accordance with JEDEC and AEC-Q101 standards, including HTSL, HAST, TC, and MSL testing, and contribute to root cause investigations for any reliability failures encountered during qualification or production. (10%)
· Failure Analysis & Yield Support: Perform systematic failure analysis of package-related defects — including die cracking,



chipping, delamination, wire bond lift, and interconnect degradation — and help implement corrective actions to improve yield and long-term product reliability. (10%)
· Cross-Functional Collaboration: Partner closely with IC design, process engineering, product engineering, and test teams to ensure package constraints and parasitics are accounted for early in the product development cycle, and provide packaging input to NPI planning and tape-out reviews. (10%)
· Package Simulation & Characterization: Conduct package-level electrical and thermal simulations to optimize package performance for high-current transient protection applications, and validate simulation results through characterization and bench testing. (10%)
· Technology Roadmap Support: Contribute technical input to the advanced packaging technology roadmap owned by the principal packaging engineer, helping identify emerging pack

📌 Sr. Packaging Engineer (Hyderabad)
🏢 Semtech
📍 Hyderabad

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