Meet the Team

The mechanical & thermal team is an integrated part of Hardware organization, responsible for varieties of complex electro-mechanical designs, which includes but are not limited to central office networking products (product ranges from 1RU to 40RU sizes), outdoor mobility equipment, high performance thermal solutions and complex PCB assemblies.

Your Impact

* Design and development of next generation Telecom & Datacentre products
* Participate in the architecture definition, implementation and verification phases.
* Work closely with ASIC team during initial characterisation and define system level integration based on acquired input.
* Develop and implement process and design improvement guidelines and ensure they are relevant to the latest Design methodology.
* Work with multi-functional teams (hardware, software, diagnostics and signal integrity groups).
* Assist in complex subsystem level lab bring-up, integration, and unit test validation.
* Mentor team and formulate processes that allow team to grow and upskill.




* Have strong documentation and data management skills to ensure lessons learnt and accessible to the wider team
* Hands-on examples of using Ai tools for automation and faster data retrieval

Minimum Qualifications

*Educational Background: Requires 11+ years of hands-on experience in design of Telecom & Datacentre products with MTech/BTech in Mechanical Engineering
* Experienced in solid modelling Tools such as Creo and UG-NX
* Hands on experience with Structural Simulation tools like Ansys
* Working examples of mentoring and leading a Technical team, experience as a people manager would be an advantage
* Good knowledge of System Thermal and current cooling methodologies and limitations of each kind.

Preferred Qualifications

* Knowledge on mechanical reliability tests and Material selection to cater to corrosive environments
* Valuable English written and verbal communications. Self-motivation, partnership and strong interpersonal skil

📌 Mechanical Engineering Technical Leader || Electro-mechanical Packaging || CREO, FEA || DFM/DFA || ASIC System Integration || Exp (Bengaluru)
🏢 Cisco
📍 Bengaluru