Job/Position Summary

The Group Leader – Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and underfill performance with emphasis on placement accuracy, solder joint integrity, underfill flow and void control, adhesion, defect reduction, and high manufacturing yield.

This position plays a key leadership role in establishing a qualified and scalable die attach and underfill module for flip chip BGA, fcCSP, and wbCSP product families. The role carries combined process and equipment ownership for the module, covering process window definition, tool qualification, equipment capability, and module yield, while managing cross-functional engineering activities, building and developing the module engineering and technician team, and driving continuous process improvements.





Primary Responsibilities

• Lead development, optimization, and qualification of flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes for flip chip BGA, fcCSP, and wbCSP product families.

• Build and develop the die attach and underfill team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices, and progression planning toward independent multi-tool ownership.

• Mentor and coach entry level process engineers and technicians on die attach and underfill fundamentals, recipe structure, data-driven troubleshooting, and secure equipment handling, while driving technical excellence, process discipline, and continuous learning within the die attach and underfill group.

• Define and control critical process parameters including bond force, bond tempera

📌 Group Leader – Die Attach (Bhubaneswar)
🏢 3D Glass Solutions
📍 Bhubaneswar