Group Leader – Die Prep (Bhubaneswar)

Group Leader – Die Prep (Bhubaneswar)

02 Oct
|
3D Glass Solutions
|
Bhubaneswar

02 Oct

3D Glass Solutions

Bhubaneswar

Job/Position Summary

The Group Leader – Die Prep & Dicing is responsible for leading development, optimization, qualification, and manufacturing support activities for wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice die inspection processes used in advanced semiconductor assembly. The role focuses on achieving robust die preparation performance with emphasis on die thickness control, total thickness variation, die strength, kerf quality, defect reduction, and high manufacturing yield.

This position plays a key leadership role in establishing a qualified and scalable die preparation module for flip chip BGA, fcCSP, and wbCSP product families. The role carries combined process and equipment ownership for the module, covering process window definition, tool qualification, equipment capability, and module yield, while managing cross-functional engineering activities, building and developing the module engineering and technician team, and driving continuous process improvements.

Primary Responsibilities





• Lead development, optimization, and qualification of wafer backgrinding, tape lamination, tape and DAF mounting, wafer sorting, laser grooving, wafer dicing, and post-dice inspection processes for flip chip BGA, fcCSP, and wbCSP product families.

• Build and develop the die preparation team, including onboarding of entry level engineers and technicians, structured on-the-job training, skill and certification matrices, and progression planning toward independent multi-tool ownership.

• Mentor and coach entry level process engineers and technicians on die preparation fundamentals, recipe structure, data-driven troubleshooting, and protected equipment handling, while driving technical excellence, process discipline, and continuous learning within the die preparation group.

• Define and control critical process parameters including target die thickness, total thickness variation, grinding wheel selecti

📌 Group Leader – Die Prep (Bhubaneswar)
🏢 3D Glass Solutions
📍 Bhubaneswar

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