we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
We are actively seeking a Firmware Engineer Lead, based in Hyderabad
Required Experience:
- Experience developing embedded firmware for Ethernet products.
- High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
- High level of proficiency in Python for automating pre-processors/post-processors.
- Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
- Hands-on experience with Server, Storage, and/or Networking equipment (e.G. Network Switches).
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- Direct experience working on products with high-speed interfaces common in Data Center equipment: 100/400/800G Ethernet, Infiniband, etc
Preferred Experience:
- Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.G. BMC)
- Hands-on experience with simulation or virtual platform–based development (e.G., VDK, QEMU, or similar)
Qualifications:
- Solid academic and technical background in electrical engineering. At a mi
📌 Hiring: Firmware Engineer-Lead (Bengaluru)
🏢 Kandou AI
📍 Bengaluru
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