Engineer, Staff_Customer Engineering_Power&Thermal (Bengaluru)

Engineer, Staff_Customer Engineering_Power&Thermal (Bengaluru)

03 Oct
|
Qualcomm
|
Bengaluru

03 Oct

Qualcomm

Bengaluru

Company:
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Software Applications Engineering
General Summary:
JOB OVERVIEW
This position is part of the Qualcomm Customer Engineering Group, which collaborates closely with partners and customers — from concept through commercialization — across Qualcomm's broad Snapdragon platform portfolio. The team supports all aspects of embedded software including hardware and software architecture, feature prototyping, feature integration, software customization, performance and power optimization, system validation, and complex debugging efforts critical to product launch.
This is a Staff-level Customer Engineering position focused on Power and Thermal software, system power management, and low-power architecture across a wide range of Qualcomm Snapdragon platforms and operating environments — including Android, Linux (LV/Yocto), QNX, and multi-OS virtualized stacks (e.g., HGY, HQX, and other product families).
The role provides technical leadership in troubleshooting complex customer issues,



defining application-level power and thermal solutions, developing design recommendations, and driving resolution across HLOS, non-HLOS, hypervisor, chipset, and customer engineering teams. Key technical focus areas include Suspend to RAM (S2R), Agile Sleep, PCM, thermal management, subsystem power states, and system suspend/resume flows.
KEY RESPONSIBILITIES
? Power & Thermal Technical Leadership
• Lead troubleshooting of complex Power and Thermal software issues across multiple Snapdragon platforms and OS environments (Android, Linux, QNX, and others).

• Provide technical leadership for customer issues involving:

• Power management features – S2R, Dynamic Sleep / DSQB, PCM, and other low-power modes

• Thermal management and TDP workload characterization across product families

• Device and subsystem power states (AOP, RPMh, LPASS/ADSP, DSPs, NSP)

• Virtual-machine and hypervisor power interactions in m

📌 Engineer, Staff_Customer Engineering_Power&Thermal (Bengaluru)
🏢 Qualcomm
📍 Bengaluru

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