Engineer- Multi-Physics Sign-off (Bengaluru)

Engineer- Multi-Physics Sign-off (Bengaluru)

03 Oct
|
ARM
|
Bengaluru

03 Oct

ARM

Bengaluru

We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams.

The ideal candidate brings hands-on understanding of advanced-node implementation and signoff, combined with robust scripting, flow ownership, and cross-team collaboration skills.

Responsibilities

This is a hand-on role for delivering tool-flow-methodology and automation.

3DIC / 2.5D CAD Flow Development

• Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies
• Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout
• Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management




• Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows

Timing, Power, and Reliability Methodology

• Develop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategies
• Enable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systems
• Define guidelines for ESD verification in advanced packaging contexts
• Assist with tool qualification, correlation, and signoff criteria definition

Thermal, CFD, and Multiphysics Methodology

• Develop and support thermal analysis methodologies for 3DIC and 2.5D designs
• Enable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to system
• Support coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysis
• Partner with design and package teams to incorporate thermal consid

📌 Engineer- Multi-Physics Sign-off (Bengaluru)
🏢 ARM
📍 Bengaluru

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