Staff Engineer (Bengaluru)

Staff Engineer (Bengaluru)

03 Oct
|
infineon
|
Bengaluru

03 Oct

infineon

Bengaluru

Responsible for Physical Verification, Reliability Sign-off, EM/IR Analysis, Power Grid Design, Analog/Mixed-Signal Integration, and methodology development for complex low-power SoCs targeting IoT and MCU applications

Your roleKey responsibilities in your new role

• Drive Physical Verification (PV), ESD, and Reliability Sign-off activities for complex low-power SoCs targeting IoT and MCU applications.
• Perform Physical Design and Timing Closure for ICW SoCs. Execute and own Physical Verification and Reliability Checks to ensure design quality and manufacturability.
• Conduct Power Grid Design, including power switch estimation and optimization.
• Perform Static and Agile EM/IR Analysis for multi-voltage and multi-power domain designs.
• Lead I/O Planning and Package Co-design activities for SoC implementation.
• Drive Analog and Mixed-Signal IP Integration into SoC designs.
• Develop and improve design flows, methodologies, QoR (Quality of Results), and sign-off processes.
• Collaborate closely with Physical Design, STA, DFT, RTL, DV Engineers,



and Chip Architects to ensure successful project execution.
• Support implementation of SoCs with multiple voltage islands, power islands, and low-power design techniques

Your profileQualifications and skills to help you succeed

• Bachelor’s or Master’s degree in VLSI Design with 5 -8 years of relevant industry experience.
• Hands-on experience in Physical Verification (PV), ESD, and Reliability Sign-off for complex SoCs.
• Strong expertise in Power Grid Design, Power Switch Estimation, and Static/Dynamic EMIR Analysis for multi-voltage and multi-power domain designs.
• Deep understanding of low-power SoC implementation, including multiple voltage islands, power islands, and power reduction techniques.
• Experience with industry-standard Physical Verification and Power Grid Sign-off tools.
• Knowledge of semiconductor technologies including 40nm, 28nm, and 22nm nodes, along with WireBond and FlipChip packaging methodo

📌 Staff Engineer (Bengaluru)
🏢 infineon
📍 Bengaluru

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