About the Company

- Sasken Technologies is a global leader in Product Engineering and Embedded Software delivering concept-to-market and chip-to-cognition R&D; solutions across semiconductors, automotive, industrials, consumer electronics, smart and enterprise devices, satellite communications, telecom, and transportation.
- For more than 36 years, Sasken has used its engineering expertise and patented technologies to support over 100 Fortune 500 companies and power more than a billion devices worldwide.
- With the acquisition of Borqs Technologies, Sasken has strengthened its capabilities in Original Design Manufacturing (ODM). This brings together end-to-end capabilities from product ideas and IP development to engineering, manufacturing, and commercialization for connected products such as mobile phones, tablets, smartwatches, rugged devices, critical communication devices, and IoT solutions.
- Sasken Silicon adds advanced ASIC design, SoC development, and semiconductor engineering capabilities, helping customers build next-generation products.

About the Role

This role is responsible for the development of Board Support Package (BSP) features, including I2C, UART, GPIO, MIPI, USB, SPI, SDIO, I2S, PCM, Ethernet, and reliability features for Rolling Wireless module development. The incumbent will contribute to the successful integration of BSP components, ensuring high performance and reliability.

Responsibilities

As a member of the Current Product Development Team, the incumbent will be responsible for the design, development, debugging, and testing of BSP-related features for Rolling Wireless modules. The role involves writing high-quality C code, debugging complex system-level issues, conducting thorough unit testing,



and collaborating in design and code reviews to ensure robust and efficient BSP implementations.

Key Accountabilities / Statement of Work

1. BSP Feature Development – Design and implement high-quality BSP features, including SW Architecture Design and Software Component Detailed Design.
2. Coding & Code Quality – Follow Rolling Wireless coding standards and deliver high-quality C code.
3. Debugging & Troubleshooting – Utilize GDB, KDB, QXDM, QPST, and other tools to debug BSP-related issues.
4. Unit Testing Development – Develop comprehensive unit test cases and ensure BSP features pass all required tests.
5. Technical Issue Resolution – Troubleshoot and resolve critical technical issues in BSP development.

Qualifications

Education – Bachelor’s degree in Electrical Engineering (BSEE), Computer Science (CS) (mandatory)

Required Skills

1. Experience – Minimum 2 years of experience in embedded software development.
2. Programming Skills – Strong proficiency in C programming.
3. Processor & Architecture Knowledge – Familiarity with ARM architecture and ARM assembly language.
4. Debugging & Tools – Proficiency with embedded software debugging methods and tools.
5. Problem-Solving & Communication – A creative and quick learner with strong analytical skills and excellent verbal and written communication in English

Preferred Skills

1. Experience in innovating and prototyping new embedded technologies.
2. Demonstrated ability to take ownership of tasks and drive them to completion.
3. Telematics & Network Access Devices – Experience in Telematics and Network Access Device (NAD) development is an advantage.
4. Platform-Specific Experience – Experience with Qualcomm platforms is preferred.

📌 Embedded Engineer (Maharashtra)
🏢 Sasken Technologies
📍 Maharashtra