Job Title: Subject Matter Expert (SME) – HVAC & Liquid Cooling (AI Data Centers)

Location: Mumbai

Department: AI Datacenter Design Engineering & Technical Architecture Team

Reports To: Head of Design

Position Overview

We are seeking a top-tier Subject Matter Expert (SME) – HVAC & Liquid Cooling to serve as the ultimate technical authority on thermal engineering, liquid cooling innovation, and HVAC architecture for our next-generation AI data centers.

You will lead the design standards, fluid dynamics modeling, vendor benchmarking, and technical validation for high-density cooling infrastructure. This role is responsible for ensuring our facilities reliably support 100 kW to 150 kW+ per rack GPU deployments using direct-to-chip, immersion, and advanced hydronic cooling loops.

Key Responsibilities

- Advanced Liquid Cooling Architecture & Innovation

Direct-to-Chip & Immersion Topology: Define the global technical standards for direct-to-liquid cold plate loops, single/two-phase immersion cooling, Coolant Distribution Units (CDUs), and Rear Door Heat Exchangers (RDHx).

Fluid Dynamics & Thermal Modeling: Lead Computational Fluid Dynamics (CFD) modeling, hydronic network calculations, pressure drop analysis, and thermal capacity planning for high-density GPU clusters (e.g., NVIDIA H100/B200/GB200).

Coolant Chemistry & Fluid Management: Establish strict fluid quality guidelines, dielectric/glycol chemical specs, water treatment protocols, filtration standards, and corrosion prevention controls.

- HVAC & Central Plant Optimization

Primary Heat Rejection Systems: Architect low-PUE primary cooling systems, including magnetic-bearing chillers, adiabatic dry coolers, free-cooling economizers, and cooling towers.

Hybrid Air & Liquid Systems:



Design balanced thermal environments where liquid cooling handles 80–90%+ of rack heat load while supplementary CRAH/CRAC units maintain ambient data hall humidity and air distribution.

Energy & Sustainability Optimization: Drive industry-leading Power Usage Effectiveness (PUE) and Water Usage Effectiveness (WUE) metrics aligned with ASHRAE TC 9.9 liquid cooling guidelines.

- Peer Review, Troubleshooting & OEM Engagement

Design Validation & Review: Perform deep-dive technical reviews of MEP consultant drawings, single-line hydronic schematics, and equipment specifications across all global projects.

Root-Cause Failure Analysis: Serve as the escalation lead for complex thermal failures, fluid leaks, pressure drops, or CDU performance degradation during testing or live operations.

Vendor Benchmarking & R&D;: Evaluate next-gen liquid cooling hardware from global OEMs, pilot emerging cooling technologies, and drive custom equipment engineering with suppliers.

Qualifications & Requirements

Experience: 12–15+ years in data center HVAC/thermal engineering, with at least 5+ years dedicated exclusively to liquid cooling technologies for hyperscale or HPC environments.

Domain Mastery: Recognized authority in direct-to-chip liquid cooling, CDU design, hydronic loop balancing, coolant fluid dynamics, and ASHRAE TC 9.9 standards.

AI Density Focus : Proven track record designing and validating thermal solutions for 100 kW to 150 kW+ per rack power densities.

Education: Master’s or Ph.D. degree in Mechanical Engineering, Thermal Science, or Fluid Mechanics (PE license or Chartered status preferred).

Key Skills : CFD simulation software (6SigmaET / Ansys Fluent), hydronic network modeling, PUE/WUE optimization, failure mode analysis (FMEA), and OEM vendor technical oversight.

📌 HVAC & Liquid Cooling (AI Data Centers) - SME (Mumbai)
🏢 HCLTech
📍 Mumbai